OWC 8GB DDR3 1600 CL11 2Rx8 1.5V Non-ECC DIMM for OptiPlex 9020
- 8GB
- 240-Pin DDR3 Non-EC…
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OWC
This 4GB DDR4 SODIMM is built to match the exact specifications of the HP 22-b010nt, 22-b012nl, 22-b012nt, 22-b013nt and 22-b014nl. It delivers a straightforward capacity increase for owners of those models who need more memory for everyday multitasking. The module is not suitable for systems that require ECC, registered memory or a different pin count.
Running at 1.2V, the stick draws minimal power and generates little heat inside the tight chassis of the compatible all-in-one PCs. No heat spreader is fitted, so the module relies on the system's existing airflow, which is sufficient at this voltage and speed. The CL15 latency at 2133MHz provides standard responsiveness without increasing the thermal load.
The unbuffered, single-rank 1Rx8 layout drops directly into the SO-DIMM socket without adapters or configuration changes. JEDEC and RoHS compliance mean the upgrade preserves the original warranty status of the HP unit. Buyers who need capacities beyond 4GB per slot or who prefer modules with heatsinks for overclocking headroom should look elsewhere.
| Brand | OWC |
|---|---|
| Part Number | 2S1D41R804GB |
| Capacity | 4GB |
| Type | 260-Pin DDR4 Non-ECC SODIMM |
| Speed | DDR4 2133 (PC4 17000) |
| CAS Latency | CL15 |
| Voltage | 1.2V |
| ECC | No |
| Buffered/Registered | Unbuffered |
| Rank | 1Rx8 |
| Heat Spreader | No |
| Compatible System | HP 22-b010nt HP 22-b012nl HP 22-b012nt HP 22-b013nt HP 22-b014nl |
Other versions of this model
Same family, different memory, cooler or clock — compare before you commit.
Power off, unplug, and open the case; align the notch on the module with the slot key, press firmly until the side clips click, then reassemble. The step often missed is fully seating both clips so the module cannot tilt.
No scheduled maintenance is required; the module has no heat spreader or moving parts. Replacement is only needed if a memory test reports errors or the system no longer recognises the 4GB capacity.
The 4GB capacity is the first bottleneck; once the operating system exhausts the 4GB address space it swaps to storage, causing latency spikes well before thermal or voltage limits are reached.
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