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Prolimatech

Prolimatech PK-1/PROLIMA Nano Aluminium Thermal Compound 5g

SKU CH-FVR4-3R74V MPN PK-1/PROLIMA

Nano aluminium thermal compound in a 5 g syringe for CPU or GPU heat transfer

  • 5 g tube covers multiple CPU applications
  • Nano aluminium particles fill microscopic surface gaps
  • Non-conductive formula prevents electrical short circuits
  • Optimised viscosity allows easy, even spreading

Thermal compound for CPU and GPU

Prolimatech PK-1/PROLIMA is a nano aluminium thermal compound supplied in a 5g syringe. It fills microscopic gaps between a processor die and a cooler base to improve heat transfer. The paste suits desktop builders and laptop maintainers who need reliable thermal interface material.

Non-conductive aluminium formula

The compound uses nano-scale aluminium particles and contains no metal oxides that could cause electrical shorts if it spreads beyond the die. Its consistency allows easy spreading with a spatula or the cooler pressure itself. The 5g volume covers multiple applications for system builders or single upgrades. Buyers needing higher thermal conductivity ratings or specialised liquid-metal performance should consider alternative products.

Highlights

  • 5 g tube covers multiple CPU applications
  • Nano aluminium particles fill microscopic surface gaps
  • Non-conductive formula prevents electrical short circuits
  • Optimised viscosity allows easy, even spreading

Specifications

No published specifications for this item yet.

Questions about this item

Is this thermal compound electrically conductive?

The nano-aluminium formula is non-conductive, so it will not cause short circuits if it contacts nearby components.

Does the 5 g syringe include a spreader for even application?

A plastic spreader is supplied in the package to help create a thin, uniform layer on the CPU or GPU die.

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