BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
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SAMSUNG
32 GB DDR3L load-reduced ECC server memory running at 1600 MHz with CL11 latency and 1.35 V operation
This Samsung module delivers 32 GB of DDR3L memory at 1600 MT/s with a CAS latency of CL11. It operates at 1.35 V and uses a 240-pin form factor with load-reduced buffering and ECC registration. The quad-rank x4 organisation provides high density for server platforms that support this configuration.
The module fits systems that accept 240-pin DDR3L registered DIMMs with load-reduced signalling and ECC. It is not for desktop boards that require unbuffered non-ECC memory, nor for platforms limited to standard registered DIMMs without load-reduced support. Buyers needing lower capacities or different voltages should look at other modules.
Verify that your server motherboard or workstation explicitly qualifies 32 GB load-reduced DDR3L DIMMs at 1.35 V and CL11 timing. Confirm the memory controller supports quad-rank x4 organisation and that the BIOS version in use enables the required speed. Ensure the DIMM slots are keyed for 240-pin DDR3L registered modules before ordering.
| Capacity | 32GB |
|---|---|
| Type | 240-Pin DDR3 SDRAM |
| Speed | DDR3L 1600 (PC3L 12800) |
| CAS Latency | CL11 |
| Voltage | 1.35V |
| Buffered/Registered | Load Reduced |
Yes — this module is a 240-pin DDR3L DIMM with Load Reduced buffering, so the board must provide DDR3L slots that accept registered, load-reduced memory.
Mixing Load Reduced and standard registered DIMMs is not supported; all slots in a channel should use the same registered/load-reduced type and matching voltage.
Check the BIOS memory information or a tool such as CPU-Z; it should report 1600 MT/s, 1.35 V, CAS latency 11 and the 32 GB capacity per DIMM.
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