Micron Technology, Inc. MT4JTF12864AZ-1G4D1 1GB DDR3 1333 Desktop RAM
- 1GB
- DDR3 1333 (PC3 1060…
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Sapphire Tech
8GB GDDR5 card with a 1.04 GHz core clock, triple-fan cooler and 512-bit memory interface
The Sapphire Nitro R9 390 is a full-length PCI Express 3.0 graphics card built around the AMD Radeon R9 390 GPU. It carries 8GB of GDDR5 memory on a 512-bit interface and runs at a 1.04 GHz core clock. The board targets gamers and creators who need high memory capacity for 4K textures and multi-monitor Eyefinity setups.
A triple-fan fansink with intelligent fan control keeps the GPU quiet during everyday desktop work and light gaming. The card draws up to 375W under typical load and requires two 8-pin PCIe power connectors. Sapphire specifies a 750W system power supply to ensure stable operation across the full platform.
During extended sessions the cooler maintains steady airflow across the heatsink while the 16K-hour capacitors and black diamond chokes support consistent power delivery. AMD PowerTune and ZeroCore Power adjust clocks and voltage dynamically so performance scales with thermal headroom rather than throttling abruptly.
| Brand | SAPPHIRE |
|---|---|
| Series | R9 300 |
| Interface | PCI Express 3.0 |
| Chipset Manufacturer | AMD |
| GPU | R9 390 |
| Core Clock | 1.04 GHz |
| Memory Size | 8GB |
| Memory Type | GDDR5 |
| OpenGL | OpenGL |
| HDMI | Yes |
| DisplayPort | Yes |
| DVI | Yes |
| Cooler | Fan Cooler |
| Form Factor | Plug-in Card |
| Shipping weight | 1.72 kg |
| Package size | 51 × 51 × 51 mm |
Seat the card firmly in a PCI Express 3.0 slot, then connect both 8‑pin PCI‑E power cables from the PSU; the step most often missed is plugging in the second 8‑pin connector, leaving the GPU under‑powered.
The triple‑fan fansink uses 16K‑hour rated capacitors and black‑diamond chokes; expect to clean dust from the heatsink fins every 6‑12 months and replace a fan only if bearing noise appears after several years.
The 375 W board power draw and 750 W system PSU recommendation mean the power‑delivery and thermal envelope will be reached before the 512‑bit memory bus or 2560 stream processors become bottlenecks.
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