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Small grey tub of thermal putty, 10 g, labelled UPSIREN UTP-8

UPSIREN

UPSIREN UTP-8 Thermal Putty 10g 14.8W/mk

SKU CH-DTFC-28R49

High-performance thermal putty with 14.8W/mk conductivity for GPU, IC and processor cooling, non-conductive and halogen-free

  • Volume / Net Weight10g
  • Thermal Conductivity14.8W/mk
  • Long Term Operating Temperature-55 to 200 C
  • Featuresnon-conducting

Weight 100 g

  • 20g
  • 10g
  • 50 g
  • 100 g

Struck-through versions exist but are not stocked here.

  • High thermal transfer with 14.8 W/mk conductivity
  • Stays effective from -55 °C to 200 °C
  • Non-conductive formula prevents electrical shorts
  • Replaces thermal pads and fully fills gaps
  • RoHS compliant and halogen-free for safe use

High-conductivity thermal putty

UPSIREN UTP-8 is a 10 g thermal compound rated at 14.8 W/mK for high-performance heat transfer. The non-conducting formula eliminates electrical short risks on dense circuit boards. It is designed for GPU memory modules, voltage regulators and similar IC packages where a traditional pad leaves air gaps. The material stays tacky and does not dry out over time.

Replaces thermal pads on uneven stacks

Unlike solid pads, this putty flows under low pressure to fully fill irregular gaps between dies and heatsinks. It suits rework and field repair where pad thickness cannot match every component height. The RoHS-compliant, halogen-free composition meets restrictions on hazardous substances. It is not intended for CPU heat-spreader applications where silicone grease is standard.

Stable output across a wide temperature range

The compound operates continuously from -55 °C to 200 °C without hardening or losing viscosity. Low viscosity allows consistent dispensing by hand, stencil or automated equipment during assembly. Good tack keeps the material in place on vertical heatsink surfaces during vibration or thermal cycling. Long-term reliability is maintained without pump-out or bleed.

Highlights

  • High thermal transfer with 14.8 W/mk conductivity
  • Stays effective from -55 °C to 200 °C
  • Non-conductive formula prevents electrical shorts
  • Replaces thermal pads and fully fills gaps
  • RoHS compliant and halogen-free for safe use

Specifications

BrandUPSIREN
SeriesUTP-8
ModelUTP-8 10G
Volume / Net Weight10g
Thermal Conductivity14.8W/mk
Long Term Operating Temperature-55 to 200 C
Featuresnon-conducting

Questions about this item

How much thermal putty is in the 10g syringe and will it cover a typical GPU die?

The syringe contains 10 grams of UTP-8 putty, enough for multiple GPU or VRM applications since only a thin layer is needed to fill microscopic gaps.

What is the correct way to apply UTP-8 putty and what common mistake should I avoid?

Dispense a small amount directly onto the component, then mount the heatsink to spread it evenly; do not use it as a CPU silicone grease substitute as the manufacturer explicitly warns against this.

Will the putty dry out or need replacement after extended use at high temperatures?

No, the fully cured formula does not dry out and is rated for continuous operation from -55°C to 200°C, eliminating the need for periodic replacement unlike traditional thermal pads.

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