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Rectangular green circuit board with silver heatsink cover, M.2 2280 form factor

XPG

XPG ASX8100NP-2TT-C 2TB M.2 2280 PCIe 3.0 x4 NVMe internal SSD

SKU CH-PMRZ-G70WJ MPN ASX8100NP-2TT-C

2TB M.2 2280 internal SSD with 3D NAND, PCIe 3.0 x4 interface, up to 3500 MBps read and 3000 MBps write, built-in heatsink and 1280 TBW endurance

  • Device TypeInternal Solid State Drive (SSD)
  • Used ForConsumer
  • Form FactorM.2 2280
  • Capacity2TB
  • Memory Components3D NAND
  • InterfacePCI-Express 3.0 x4, NVMe 1.3

Options 2TB

  • 4TB
  • 2TB

Struck-through versions exist but are not stocked here.

  • Sequential read up to 3500 MBps for fast boot and load times
  • Sequential write up to 3000 MBps to move large files quickly
  • Random read up to 290000 IOPS for responsive multitasking
  • DRAM cache buffer plus SLC caching accelerate everyday workloads
  • 1280 TBW and 2000000 hour MTBF indicate long service life

Capacity and audience

The XPG SX8100 2TB M.2 2280 drive targets DIY enthusiasts, overclockers and graphics professionals who need fast NVMe storage. It delivers sequential reads up to 3500 MBps and writes up to 3000 MBps over a PCIe 3.0 x4 link. The 3D NAND flash provides 1280 TBW endurance and a 2,000,000-hour MTBF rating.

Bundled technologies

A built-in heatsink keeps the controller within the 0 °C to 70 °C operating window without extra parts. SLC caching and a DRAM cache buffer accelerate burst workloads, while LDPC ECC and AES 256-bit encryption protect data integrity and security. Active power draw is 0.33 W and idle drops to 0.14 W.

Installation notes

The M.2 2280 form factor fits standard motherboard slots; secure it with the single mounting screw. Ensure the heatsink does not contact nearby components or motherboard armour. The drive supports NVMe 1.3, so no legacy AHCI drivers are required, but verify BIOS recognises the device before cloning an OS.

Highlights

  • Sequential read up to 3500 MBps for fast boot and load times
  • Sequential write up to 3000 MBps to move large files quickly
  • Random read up to 290000 IOPS for responsive multitasking
  • DRAM cache buffer plus SLC caching accelerate everyday workloads
  • 1280 TBW and 2000000 hour MTBF indicate long service life

Specifications

BrandXPG
SeriesSX8100
ModelSX8100
Device TypeInternal Solid State Drive (SSD)
Used ForConsumer
Form FactorM.2 2280
Capacity2TB
Memory Components3D NAND
InterfacePCI-Express 3.0 x4, NVMe 1.3
Max Sequential ReadUp to 3500 MBps
Max Sequential WriteUp to 3000 MBps
4KB Random ReadUp to 290,000 IOPS
4KB Random WriteUp to 240,000 IOPS
Terabytes Written (TBW)1280TB
MTBF2,000,000 hours
HeatSinkwith HeatSink
FeaturesAdvanced LDPC ECC Technology
SLC Caching and DRAM cache buffer
AES 256-bit encryption support
Compact M.2 2280 form factor - ideal for gaming and high-end desktops
3D NAND Flash for higher capacity and durability
Power Consumption (Idle)0.14W
Power Consumption (Active)0.33W
Operating Temperature0°C ~ +70°C
Storage Temperature-40°C ~ +85°C
Max Shock Resistance1500G / 0.5ms
Height3.50mm
Width22.00mm
Depth80.00mm
Weight8.00g
Shipping weight0.05 kg
Package size80 × 22 × 4 mm

Questions about this item

How long before the 1280 TBW endurance rating or the 2,000,000-hour MTBF might require a replacement?

The 1280 TBW figure represents the total data you can write before the warranty expires, while 2,000,000 hours MTBF is a statistical reliability average; neither forces a scheduled swap.

Will the 3500 MBps sequential read or 3000 MBps write throttle first under sustained heavy workloads?

The drive includes a heatsink and SLC caching to manage thermals, but the 0°C to 70°C operating range is the hard limit; sustained loads that push the controller to 70°C will trigger throttling.

What are the noise, heat and power characteristics when the drive runs all day at 0.33 W active power?

Solid-state design means zero acoustic noise; active power is 0.33 W and idle drops to 0.14 W, so heat output stays low inside the 0°C to 70°C operating window.

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