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Gray thermal paste in a 4 g syringe with measurement markings and rubber cap

Zalman

Zalman ZM-STC7 thermal paste 4 g 7.2 W/m·K 220 Pa.s

SKU CH-6680-G8DGW MPN ZM-STC7

A 4 g syringe of thermal paste rated at 7.2 W/m·K with 220 Pa·s viscosity for CPU and GPU cooling

Quantity 1-Pack

  • High thermal conductivity at 7.2 W/m·K for efficient CPU and GPU cooling
  • Electrically non-conductive formula prevents short circuits on sensitive components
  • Syringe with measuring graduations enables precise application and reuse
  • Optimal 220 Pa.s viscosity spreads easily across any chip surface
  • Rubber cap keeps compound fresh and prevents hardening during storage

Thermal paste for CPU and GPU

Zalman ZM-STC7 is a 4 g syringe of gray thermal compound rated at 7.2 W/m·K thermal conductivity and 220 Pa.s viscosity. The paste uses silicone oil with alumina, aluminum and zinc oxide fillers to transfer heat from processors and graphics chips to coolers. It is non-electrically conductive and RoHS compliant. The syringe barrel carries graduated markings for accurate application.

System builders and upgraders

The compound suits anyone assembling or servicing desktops who needs a reliable, easy-to-apply paste for standard CPU or GPU mounting. Buyers who want higher thermal conductivity than 7.2 W/m·K should look at other products. Users who prefer a thinner paste for very tight gaps or a larger volume than 4 g will also need a different option.

7.2 W/m·K thermal conductivity

This single figure determines whether the paste meets the thermal budget of your cooler and chip combination. At 7.2 W/m·K the compound sits in the mid-range for consumer thermal interfaces. If your design requires 8.3 W/m·K or 9.1 W/m·K, this model will not satisfy that requirement.

Highlights

  • High thermal conductivity at 7.2 W/m·K for efficient CPU and GPU cooling
  • Electrically non-conductive formula prevents short circuits on sensitive components
  • Syringe with measuring graduations enables precise application and reuse
  • Optimal 220 Pa.s viscosity spreads easily across any chip surface
  • Rubber cap keeps compound fresh and prevents hardening during storage

Specifications

BrandZALMAN
SeriesSTC
ModelSTC 7

Other versions of this model

4 more in the same range

Same family, different memory, cooler or clock — compare before you commit.

Questions about this item

How do I choose between the STC7, STC8 and STC9 pastes?

STC7 provides 7.2 W/m·K conductivity and 220 Pa.s viscosity in a 4 g syringe; STC8 offers 8.3 W/m·K with thicker 350–480 Pa.s viscosity in 1.5 g; STC9 reaches 9.1 W/m·K at 250 Pa.s in 4 g.

What does 7.2 W/m·K mean for my CPU or GPU temperatures?

The 7.2 W/m·K rating indicates how efficiently the paste moves heat from the die to the cooler; in practice it lowers thermal resistance at the interface, helping your cooler keep the chip closer to its target temperature under load.

Is the 220 Pa.s viscosity easy to spread on a bare die or large IHS?

At 220 Pa.s the compound flows readily under mounting pressure, letting you cover both small bare dies and large integrated heat spreaders without excessive force or air pockets.

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