Akceptujemy kryptowaluty — posiadane środki można więc wykorzystać na zakup prawdziwego sprzętu.Płatność kryptowalutą — realny sprzęt w zamian. Bezpłatna, ubezpieczona dostawa na całym świecie powyżej 399 $. Neutralne kartony, bez oznaczeń, wysyłane z Niemiec.Bezpłatna, ubezpieczona dostawa powyżej 399 $. Kurs zostaje zablokowany na 30 minut od otwarcia kasy.Kurs zablokowany na 30 minut. Każdy produkt jest fabrycznie zapieczętowany, jego numer seryjny jest sprawdzany, a całość objęta jest 24-miesięczną gwarancją.Zapieczętowane fabrycznie, 24 miesiące gwarancji.

Obserwowane produkty Zaloguj się

Thermal Grizzly

Thermal Grizzly TG-MP-HC-120-100-20-2 Minus Pad 120x100x2.0mm 2-Pack thermal pad

SKU CH-YZZN-GTJ8E

High-compression thermal pad pair measuring 120x100x2.0 mm bridges uneven gaps on GPUs and SSDs while maintaining conductivity under pressure

  • FeaturesThe thermal pads of the Minus Pad High Compression series of
  • Bridges varying component heights with a single pad thanks to very high compressibility
  • Maintains strong thermal transfer even under heavy compression for reliable cooling
  • Electrically non-conductive design prevents short circuits on sensitive VRAM and VRM areas
  • Suits GPU water-block conversions and cooler repads where exact gap thickness is unknown
  • Supplied as two 120x100x2.0mm pads for multiple component coverage

High-compression thermal pad 120×100×2.0 mm

The Thermal Grizzly Minus Pad High Compression comes in a two-pack of 120 by 100 millimetre sheets with a 2.0 millimetre thickness. Very high compressibility lets a single pad bridge different component heights at once. The material is electrically non-conductive for safe use on exposed circuitry.

Replacing standard pads of uncertain thickness

When the exact gap height is unknown, these pads can be chosen slightly thicker than the originals and will compress to fit. Thermal conductivity is maintained and can increase under higher contact pressure. The design suits GPU water-block conversions and cooler re-pads where VRAM, VRMs and the die sit at different levels.

Handles mixed-height stacks on one sheet

A single pad covers memory chips, voltage regulators and the GPU die simultaneously, accommodating the height tolerances between them. It runs out when the required compression exceeds the material’s elastic limit or when a larger surface area than 120 by 100 millimetres is needed.

Najważniejsze cechy

  • Bridges varying component heights with a single pad thanks to very high compressibility
  • Maintains strong thermal transfer even under heavy compression for reliable cooling
  • Electrically non-conductive design prevents short circuits on sensitive VRAM and VRM areas
  • Suits GPU water-block conversions and cooler repads where exact gap thickness is unknown
  • Supplied as two 120x100x2.0mm pads for multiple component coverage

Specyfikacja

BrandThermal Grizzly
ModelTG-MP-HC-120-100-20-2
Part NumberTG-MP-HC-120-100-20-2
FeaturesThe thermal pads of the Minus Pad High Compression series offer extremely high compressibility combined with excellent thermal conductivity. They are especially practical when converting a graphics card to a water cooler, as a single pad thickness can be used across various contact points.

Pytania dotyczące tego produktu

What are the exact dimensions of each pad in the 2-pack?

Each pad measures 120 mm by 100 mm with a thickness of 2.0 mm.

How should the Minus Pad High Compression be installed on a GPU, and what common mistake should be avoided?

Remove the protective films, place the pad on the component, and let the cooler's mounting pressure compress it; do not pre-compress or stretch the pad by hand.

Will the thermal pads need replacement after extended use, and what indicates they are worn?

The pads are designed for long-term stability and do not dry out; replace only if physical damage occurs or if temperatures rise unexpectedly after years of service.

Także w tym dziale

Klienci porównywali też te produkty

Ten sam dział, ta sama kasa — osiem kryptowalut i 30-minutowa blokada kursu.