Aceitamos criptomoeda — para que as moedas que detém possam comprar material informático real.Pague em cripto, gaste-a em material informático real. Envio seguro gratuito para todo o mundo acima de 399 $. Caixas neutras, sem marca, expedidas a partir da Alemanha.Envio seguro gratuito acima de 399 $. A sua taxa fica bloqueada durante 30 minutos assim que abre a finalização da compra.Taxa bloqueada 30 minutos. Cada artigo é selado, o seu número de série é verificado, e está coberto por uma garantia de 24 meses.Selado, garantido 24 meses.

Artigos guardados Iniciar sessão
Intel Xeon W-3245M 16-core server CPU in OEM tray

Intel

Intel Xeon W-3245M 16-core 3.2 GHz server processor OEM

SKU CH-D216-G59F0

16-core server processor running at 3.2 GHz with 22 MB L3 cache on a 14 nm process for Socket 3647 platforms

  • NameW-3245M
  • CPU Socket TypeSocket 3647
  • # of Cores16-Core
  • Operating Frequency3.2 GHz
  • FSB3.20 GHz
  • L3 Cache22MB
  • 16 cores handle parallel workloads efficiently
  • 2 GHz base frequency delivers consistent single-thread speed
  • 22 MB L3 cache reduces data latency
  • 14 nm process balances performance and power
  • 205 W TDP enables sustained high-load operation

16-Core Xeon for Workstation Workloads

The Intel Xeon W-3245M delivers sixteen cores running at 3.2 GHz with 22 MB of L3 cache on a 14 nm process. It fits the LGA 3647 socket and carries a 205 W thermal design power. This OEM processor targets professionals running multi-threaded compute, rendering or simulation tasks that benefit from high core counts. Buyers needing integrated graphics or lower power draw should look elsewhere.

OEM Packaging Means No Extras

The unit ships as an OEM pack without a stock cooler, retail box or bundled software. System builders must source a compatible LGA 3647 heatsink and apply their own thermal interface material. No installation media or licence keys are included, so the operating environment must be prepared separately. This keeps the package lean for integrators who already have cooling infrastructure.

Socket 3647 Mounting and Power Delivery

The LGA 3647 interface uses a narrow ILM mechanism that requires a compatible motherboard tray and firm, even pressure during installation. With a 205 W TDP the voltage regulators and cooling solution must sustain heavy continuous loads without throttling. The 64-bit architecture supports large memory configurations, though maximum capacity and speed depend on the platform chosen. Ensure the chassis airflow can handle the thermal output.

Pontos fortes

  • 16 cores handle parallel workloads efficiently
  • 2 GHz base frequency delivers consistent single-thread speed
  • 22 MB L3 cache reduces data latency
  • 14 nm process balances performance and power
  • 205 W TDP enables sustained high-load operation

Especificações

BrandIntel
SeriesXeon
NameW-3245M
CPU Socket TypeSocket 3647
# of Cores16-Core
Operating Frequency3.2 GHz
FSB3.20 GHz
L3 Cache22MB
Manufacturing Tech14 nm
64-Bit SupportYes
Thermal Design Power205W

Perguntas sobre este artigo

Will the 205 W TDP require a specific cooler replacement later?

The 205 W thermal design power means a server-grade cooler rated for at least that load is needed; plan to replace the cooler if it cannot sustain 205 W continuously.

What limit appears first when all 16 cores run at 3.2 GHz for hours?

The 205 W power envelope is the first hard limit; sustained full-core load will hit the thermal ceiling before any other bottleneck.

How loud and hot does the 14 nm, 205 W chip get under all-day load?

Expect significant heat output at 205 W; noise depends on the cooler chosen, but a high-airflow or liquid solution is typical for 24/7 operation.

Também nesta secção

Os clientes também compararam

Mesma prateleira, mesma finalização da compra — oito moedas e uma taxa bloqueada durante 30 minutos.