ASUS TUF GAMING B850M-PLUS & Ryzen 9 9950X3D AMD motherboard CPU combo
- AM5
Sprejemamo kriptovalute — tako lahko sredstva, ki jih imate, kupijo pravo strojno opremo.Plačajte v kriptovaluti, zapravite jo za pravo strojno opremo. Brezplačna zavarovana dostava po vsem svetu nad 399 $. Nevtralni kartoni brez znamke, poslani iz Nemčije.Brezplačna zavarovana dostava nad 399 $. Vaš tečaj je zaklenjen za 30 minut, takoj ko se odpre blagajna.Tečaj zaklenjen 30 minut. Vsak izdelek je zapečaten, njegova serijska številka preverjena, in krit z 24-mesečno garancijo.Zapečateno, 24-mesečna garancija.
ASUS
Pairs an AM5 motherboard with a 12-core Ryzen 9 9900X3D, DDR5 support, PCIe 5.0 M.2, Wi-Fi 6E and 2.5Gb Ethernet
Motherboard TUF GAMING B850-E WIFI
CPU + Ryzen 9 9900X3D
This bundle pairs the ASUS TUF GAMING B850-E WIFI motherboard with an AMD Ryzen 9 9900X3D processor. The board uses the AMD AM5 socket and supports Ryzen 7000, 8000 and 9000 series CPUs. It targets enthusiasts who want a single package for advanced AI workloads and high-end gaming. DDR5 memory is required for operation.
An 8+2+1 power design uses 80A DrMOS stages on an 8-layer PCB with alloy chokes and durable capacitors. Enlarged VRM and PCH heatsinks join a flexible M.2 heatsink and hybrid fan headers managed by Fan Xpert 4. The CPU has a 120W base power rating. Cooling capacity scales with the installed cooler and case airflow.
The processor delivers 128MB of L3 cache and 12MB of L2 cache built on TSMC 4nm FinFET Granite Ridge Zen 5 architecture. Integrated AMD Radeon graphics provide display output without a discrete card. This cache size is the key differentiator for latency-sensitive gaming and AI tasks. Ensure your cooler and power supply match the 120W thermal design.
| Brand | ASUS |
|---|---|
| Model | TUF GAMING B850-E WIFI+R9 9900X3D |
| CPU Socket Type | AM5 |
Druge različice tega modela
Ista družina, različen pomnilnik, hladilnik ali takt — primerjajte, preden se odločite.
Align the triangle on the CPU with the socket marker, lower it gently without pressure, then close the retention arm; the common mistake is forcing the chip before the arm is fully latched, which can bend the delicate contact pads.
Plan to renew the thermal paste every few years and clean dust from the enlarged VRM heatsink, M.2 heatsink and PCH heatsink so the comprehensive cooling keeps the 128MB L3 cache processor stable.
The VRM temperature ceiling is reached before the 8-layer PCB or ProCool connectors saturate, so adequate case airflow over the enlarged heatsink becomes the limiting factor.
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