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Bailink

Bailink PTM7950 Phase Change Thermal Pad 31x50x0.2mm 8.5 W/mK

SKU CH-XRX9-TFQAE

Phase-change pad melts at 45°C to fill gaps, delivering 8.5 W/mK conductivity with impedance below .04 °C cm²/W and rated for 1000 cycles at 150°C

  • Thermal Conductivity8.5 W/mK
  • FeaturesPTM7950 is a highly thermally conductive Phase Change Materi
  • Phase change at 45 °C fills microscopic gaps for lower contact resistance
  • 5 W/mK conductivity moves heat efficiently from CPU or GPU
  • Low thermal impedance under 0.04 °C·cm²/W keeps temperatures down
  • Survives 150 °C bake and 1000 thermal cycles for long-term reliability
  • 31 × 50 × 0.2 mm pad fits PS5, Steam Deck, ROG Ally, laptop and M.2 SSD

Phase-change pad 31×50×0.2 mm

The Bailink PTM7950 is a phase-change thermal pad supplied in a 31 × 50 × 0.2 mm sheet. It transitions at 45 °C to fill microscopic gaps between a processor and its cooler. The pad is packaged with a screwdriver, cleaning wipe, spatula, gloves and brush for installation.

Suits precise PCM installs, not paste users

Builders who want a high-conductivity phase-change material with long-term reliability will appreciate the 8.5 W/mK rating and sub-0.04 °C·cm²/W impedance. Users who prefer traditional thermal paste or lack experience handling phase-change media should consider alternative solutions.

8.5 W/mK conductivity at 0.2 mm thickness

The single specification that decides fit is the 8.5 W/mK thermal conductivity combined with the 0.2 mm bond-line thickness. This figure determines whether the pad meets the thermal budget of the target CPU, GPU, SSD or laptop application.

商品特色

  • Phase change at 45 °C fills microscopic gaps for lower contact resistance
  • 5 W/mK conductivity moves heat efficiently from CPU or GPU
  • Low thermal impedance under 0.04 °C·cm²/W keeps temperatures down
  • Survives 150 °C bake and 1000 thermal cycles for long-term reliability
  • 31 × 50 × 0.2 mm pad fits PS5, Steam Deck, ROG Ally, laptop and M.2 SSD

商品規格

BrandBailink
SeriesPTM7950 31x50x0.2mm Phase Change Thermal Pad
Thermal Conductivity8.5 W/mK
FeaturesPTM7950 is a highly thermally conductive Phase Change Material (PCM) that lasts longer and is more effective than tradiational thermal paste.
Size 31x50x0.2mm, Phase change at 45°C, Thermal Conductivity: 8.5 W/m.K, It is normal for it to melt at high temperatures.It achieves good heat dissipation performance through repeated melting and solidification. Note: it requires technical and operational skills, it is recommended to use under the guidance of professionals
PTM7950 is a proprietary material that provides superior reliability (pass 150˚C baking 1000 hours, T/C-B 1000 cycles) and

商品問答

How does the 8.5 W/mK conductivity translate once the pad is installed?

At 45 °C the material changes phase to liquid, wets the surfaces and achieves a thermal impedance below 0.04 °C·cm²/W without a shim.

What does the phase-change behaviour cap in practice?

The pad stays solid until 45 °C, then melts to fill gaps; it withstands 150 °C baking for 1000 hours and 1000 thermal cycles without degrading.

Will the 31×50×0.2 mm sheet cover my CPU or GPU die?

The pad measures 31 mm by 50 mm and is 0.2 mm thick, sized for typical laptop CPU, GPU, SSD or console APU footprints.

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