BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
Corsair
16 GB kit of four 4 GB DDR4 3000 CL16 modules with anodized aluminum heatspreaders at 1.35 V
This Corsair kit delivers 16GB of DDR4 3000 memory across four 4GB modules with CL16 latency and 1.35V operation. It targets enthusiasts who want a matched quad-channel set for desktop systems that support DDR4 speeds. The anodized aluminum heatspreaders help maintain stable temperatures during extended use.
Builders replacing mismatched sticks or lower-speed DDR4 gain a tested 3000 MT/s kit with 16-18-18-36 timings. The upgrade makes sense when the platform can run XMP profiles at this frequency and the workload benefits from consistent quad-channel bandwidth. Systems locked to lower JEDEC speeds will not see the rated performance without BIOS support.
The reduced-height heatspreaders clear most CPU coolers, so installation is a standard DIMM slot insertion until the latches click. The main issues appear when the motherboard defaults to a lower JEDEC speed or when the BIOS needs an update to enable the XMP profile at 1.35V. Populating all four slots can also stress the memory controller on some platforms, requiring manual voltage or timing adjustments.
| Brand | CORSAIR |
|---|---|
| Series | Vengeance LPX |
| Model | CMK16GX4M4C3000C16 |
| Capacity | 16GB (4 x 4GB) |
| Speed | DDR4 3000 (PC4 24000) |
| CAS Latency | CL16 |
| Timing | 16-18-18-36 |
| Voltage | 1.35V |
| Color | Black |
| Heat Spreader | Anodized Aluminum |
| Features | Designed for high-performance overclocking Each VENGEANCE LPX module is built with a pure aluminum heatspreader for faster heat dissipation and cooler operation; and the custom performance PCB helps manage heat and provides superior overclocking headroom. Each IC is individually screened for performance potential. Designed for great looks Available in multiple colors to match your motherboard, your components, or just your style. Performance and Compatibility VENGEANCE LPX is optimized and compatibility tested for the latest Intel and AMD DDR4 Series motherboards and offers higher fr |
| 出貨重量 | 0.20 kg |
| 包裝尺寸 | 155 × 91 × 18 mm |
The low-profile heatspreader is designed to fit smaller spaces and reduce height, improving clearance for bulky CPU coolers in tight builds.
Yes, enable the XMP profile in BIOS to run at DDR4 3000 with 16-18-18-36 timings at 1.35V; otherwise the modules will default to a lower JEDEC speed.
No routine maintenance is needed; simply keep the interior dust-free so airflow can cool the aluminum heatspreaders effectively over time.
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