BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
Corsair
32 GB dual-channel DDR4 kit at 3600 MHz CL18 with 1.35 V XMP 2.0 profile and low-profile anodised aluminium heatspreaders
This 32 GB kit provides two 16 GB DDR4 3600 modules with CL18 timing and 1.35 V operation. The black anodized aluminum heatspreaders keep temperatures low in compact builds. Intel XMP 2.0 allows a single-step profile load for the rated frequency and timings.
The low-profile height suits small-form-factor cases and large CPU coolers. Compatibility testing covers AMD X570, X470, 300 Series and 400 Series chipsets plus Ryzen processors. Builds that require lower latency or higher frequency than CL18 3600 MT/s should consider different modules.
The CAS latency of 18 at 3600 MT/s determines real-world responsiveness. If your workload benefits from tighter timings, verify this CL18 figure against alternatives before purchase.
| Brand | CORSAIR |
|---|---|
| Series | Vengeance LPX |
| Model | CMK32GX4M2Z3600C18 |
| Capacity | 32GB (2 x 16GB) |
| Type | 288-Pin PC RAM |
| Speed | DDR4 3600 (PC4 28800) |
| CAS Latency | CL18 |
| Timing | 18-22-22-42 |
| Voltage | 1.35V |
| BIOS/Performance Profile | Intel XMP 2.0 |
| Color | Black |
| Heat Spreader | Anodized Aluminum |
| Features | Designed for high-performance overclocking Each VENGEANCE LPX module is built with a pure aluminum heatspreader for faster heat dissipation and cooler operation and the custom performance PCB helps manage heat and provides superior overclocking headroom. Each IC is individually screened for performance potential. Designed for great looks Available in multiple colors to match your motherboard, your components, or just your style. Performance and Compatibility VENGEANCE LPX is optimized and compatibility tested for the latest Intel and AMD DDR4 motherboards and offers higher frequencie |
| Recommend Use | AMD X570 / AMD 300 Series / AMD 400 Series / AMD Ryzen Compatible / AMD TRX40 / AMD X470 |
| 出貨重量 | 0.12 kg |
| 包裝尺寸 | 157 × 86 × 13 mm |
The low-profile heat spreader is designed to fit smaller spaces and typically clears most standard air coolers, but verify your cooler's RAM clearance spec against the module height before installing.
Enter the BIOS, locate the Intel XMP 2.0 profile for this kit, enable it, save and reboot; the common mistake is leaving the board on Auto so the modules run at the default JEDEC speed instead.
No scheduled maintenance is needed; occasionally use compressed air to remove dust from the heat spreader fins so airflow stays unobstructed and the modules continue to dissipate heat effectively.
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