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Evoc

Evoc L5501C (L550JNP) 15.3" QHD+ 165Hz Ultra 7-356H RTX 5070 96 GB DDR5 2 TB NVMe gaming laptop

SKU CH-3553-ETZVM

A 15.3" QHD+ 165Hz gaming laptop with an Intel Core Ultra 7-356H processor, RTX 5070 graphics with 8GB GDDR7, 96GB DDR5 memory, and a 2TB PCIe 4.0 NVMe SSD

  • ColorBlack
  • Operating SystemWindows 11 Pro
  • CPUIntel® Core Ultra 7-356H
  • Screen16" QHD+
  • Memory96GB
  • Storage2 TB M.2 PCIe 4.0 x4 NVMe SSD
  • 3" OLED QHD+ 165Hz display for sharp motion
  • Ultra 7-356H 16-core CPU up to 4.7 GHz turbo
  • RTX 5070 with 8 GB GDDR7 for modern graphics
  • 96 GB DDR5 5600 MHz dual-channel memory
  • 2 TB PCIe 4.0 x4 NVMe SSD for fast loads

Core Performance

The Evoc L5501C pairs an Intel Core Ultra 7-356H 16-core processor with an NVIDIA GeForce RTX 5070 graphics card. Sixteen threads reach a 4.7 GHz turbo frequency for demanding workloads. Ninety-six gigabytes of DDR5 memory run at 5600 MHz in dual-channel mode. A 2 TB PCIe 4.0 x4 NVMe solid-state drive provides primary storage.

Thermal and Display Upgrade

HIDevolution applies Gelid GC Extreme thermal interface material to the CPU and GPU to lower operating temperatures under load. The 15.3-inch OLED panel delivers a 2650 by 1600 resolution at a 165 Hz refresh rate. This combination targets sustained performance during extended gaming or content-creation sessions.

Build Integration

A magnesium-aluminium alloy chassis measures 13.53 by 10.31 by 0.63 to 0.78 inches and weighs 3.51 pounds. The system ships with Windows 11 Pro installed. FlexiCharger support, Intel DTT and Intel APO features are included. The compact form factor suits mobile workstations and high-refresh gaming setups.

商品特色

  • 3" OLED QHD+ 165Hz display for sharp motion
  • Ultra 7-356H 16-core CPU up to 4.7 GHz turbo
  • RTX 5070 with 8 GB GDDR7 for modern graphics
  • 96 GB DDR5 5600 MHz dual-channel memory
  • 2 TB PCIe 4.0 x4 NVMe SSD for fast loads

商品規格

BrandEVOC
SeriesL550JNP
ModelEVOC L5501C (L550JNP)
Part NumberEV-L5501C-HID17
ColorBlack
Operating SystemWindows 11 Pro
CPUIntel® Core Ultra 7-356H
Screen16" QHD+
Memory96GB
Storage2 TB M.2 PCIe 4.0 x4 NVMe SSD
Graphics CardNVIDIA® GeForce® RTX™ 5070
Video Memory8GB
Dimensions (W x D x H)13.53" (w) x 10.31" (d) x 0.63" ~ 0.78" (h)
Weight3.51 lbs.
Other FeaturesMagnesium Aluminum Alloy Top, Palm Rest and Bottom Case, FlexiCharger,Intel DTT and Intel APO
CPU TypeIntel Core Ultra 7 (Series 3)
Processor NameIntel Core Ultra 7-356H
Number of Cores16-core Processor
Core NamePanther Lake
Turbo FrequencyMax Turbo Frequency 4.7 GHz
CPU L3 Cache18 MB
ChipsetIntel®
Screen Size15.3"
TouchscreenNo
Display TypeQHD+
Resolution2560 x 1600
PanelQHD+
Refresh Rate165Hz
Display FeaturesView Angle, 100% DCI-P3 Display, Glossy Finished
GPU/VPUGeForce RTX 5070 Laptop GPU
Graphic TypeDedicated Card
SSD2 TB
HDDNo
Storage Spec2 TB M.2 PCIe 4.0 x4 NVMe SSD
Memory SpeedDDR5 5600MHz
Memory Spec48 GB x 2
Memory Type2 x SO-DIMM
Memory Slot (Total)2
Memory Slot (Available)0
Max Memory Supported128GB
LANBuilt-in Gigabit Ethernet LAN
WLANIntel Wireless Wi-Fi 7 BE211
WiFi GenerationWi-Fi 7
BluetoothYes
USB1x USB 3.2 Gen 2 port with DisplayPort 1.4 (Type C), 1x USB 3.2 Gen 2 port with DisplayPort 1.4 with Power Delivery DC in (Type C), 2x USB 3.2 Gen 1 ports (Type A)
HDMI1x HDMI output Port (with HDCP)
Audio Ports1x 2-in-1 Audio Jack (Headphone / Microphone)
AudioHigh Definition audio interface, Sound Blaster Studio+
SpeakerBuilt-in two speakers
TouchpadBuilt in Click pad with Microsoft PTP multi-gesture and scrolling function
KeyboardMulti languages, Single Zone Multi-Color illuminated full size isolated keyboard with numeric pad
WebcamBuilt-in 5.0M Hello Camera with TNR (Temporal Noise Reduction), SecureBIO and Human Presence Detection
StyleStandard
TypeGaming & Entertainment
UsageConsumer
AC Adapter/ChargerFull Range 230W AC Adapter, AC-in 100~240V, 50~60Hz, DC output 20V, 11.5A
BatteryEmbedded 3 cells Polymer battery pack 60WH

商品問答

What are the exact width, depth and height range for the 15.3 inch chassis?

The laptop measures 13.53 inches wide, 10.31 inches deep and between .63 and .78 inches tall, so verify your bag or sleeve fits those dimensions.

How is the Gelid GC Extreme thermal compound applied during the HIDevolution build process?

Technicians disassemble the cooling assembly, clean the CPU and GPU dies, spread a thin layer of Gelid GC Extreme on each die, then reassemble the heatsink with even pressure for optimal contact.

Which memory modules can be swapped later and what is the current configuration?

The system ships with two 48 GB DDR5 5600 MHz sticks occupying both SO-DIMM slots; future upgrades require replacing one or both modules with compatible DDR5 memory.

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