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Two blue low-profile DDR3 modules with heat spreaders, 3.2cm tall

G.SKILL

G.SKILL F3-2400C11D-8GAB 8GB (2×4GB) DDR3 2400 CL11 desktop RAM

SKU CH-V3P6-RMTYP MPN F3-2400C11D-8GAB

An 8 GB dual-channel DDR3 kit running at 2400 MHz with CL11 timing and a 3.2 cm low-profile heat spreader

  • Capacity8GB (2 x 4GB)
  • SpeedDDR3 2400 (PC3 19200)
  • CAS LatencyCL11
  • Timing11-13-13-31
  • Voltage1.65V
  • ECCNo
  • Dual-channel kit doubles bandwidth for responsive systems
  • CL11 11-13-13-31 timings deliver low-latency DDR3 2400 performance
  • Intel XMP 1.3 profile enables one-click overclock on Z77 platform
  • Low 3.2 cm height clears large CPU coolers in compact builds
  • 65 V operation balances speed with stability for 3rd Gen Core i7-3770K and i5-3570K

Kit for 3rd Gen Intel Core builds

This G.SKILL Ares Series kit provides 8GB of DDR3 memory in a matched pair of 4GB modules rated at 2400MHz with CL11 timings. It is built for desktop systems using 3rd Generation Intel Core processors and Z77 platform motherboards. The low-profile heat spreader measures 3.2cm tall to clear large CPU coolers or fit small form factor cases.

Suits XMP overclockers on Z77.

The kit includes Intel XMP 1.3 profiles that load the rated 2400MHz speed and 11-13-13-31 timings at 1.65V with a single BIOS selection. Builders using 3rd Generation Intel Core i7-3770K or i5-3570K processors on Z77 chipsets will see the advertised bandwidth. Systems on different platforms, or that require ECC or registered memory, cannot use this kit as specified.

Voltage decides DDR3 compatibility

Each module runs at 1.65V to reach the rated DDR3 2400 (PC3 19200) frequency and CL11 latency. If your motherboard or CPU memory controller does not support 1.65V DDR3 operation, the kit will not run at its rated specification. Verify 1.65V support before purchase.

商品特色

  • Dual-channel kit doubles bandwidth for responsive systems
  • CL11 11-13-13-31 timings deliver low-latency DDR3 2400 performance
  • Intel XMP 1.3 profile enables one-click overclock on Z77 platform
  • Low 3.2 cm height clears large CPU coolers in compact builds
  • 65 V operation balances speed with stability for 3rd Gen Core i7-3770K and i5-3570K

商品規格

BrandG.SKILL
SeriesAres Series
ModelF3-2400C11D-8GAB
Capacity8GB (2 x 4GB)
SpeedDDR3 2400 (PC3 19200)
CAS LatencyCL11
Timing11-13-13-31
Voltage1.65V
ECCNo
Buffered/RegisteredUnbuffered
Multi-channel KitDual Channel Kit
ColorBlue
Heat SpreaderYes
FeaturesDesigned for 3rd Generation Intel Core Processors and Z77 platform.
Intel XMP 1.3 Ready for 3rd Generation Intel Core Processors.
Recommended Intel Core i7-3770K processors & Core i5-3570K processors for best performance.
出貨重量0.11 kg
包裝尺寸201 × 136 × 19 mm

商品問答

What motherboard chipset and processor generation do I need to run the 2400MHz XMP profile on this Ares kit?

The XMP 1.3 profile is validated for 3rd Generation Intel Core processors on a Z77 chipset, with the i7-3770K and i5-3570K recommended for best performance.

Will the low-profile heat spreader clear a large tower CPU cooler I already own?

Yes, the modules measure only 3.2cm in height, which is designed specifically to fit beneath oversized air coolers or inside small form factor cases.

How do I confirm the kit is running at its rated 11-13-13-31 timings after enabling XMP in the BIOS?

Enter the BIOS or use a system information utility to verify the memory frequency reads 2400MHz (PC3-19200) and the timings show CL11 11-13-13-31 at 1.65V.

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