BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
Intel
An 8-core, 16-thread Xeon running at 2.6 GHz with 20 MB L3 cache for FCLGA2011 servers
This refurbished Intel Xeon E5-2670 is an 8-core, 16-thread server processor built on the 32 nm Sandy Bridge-EP architecture. It operates at a base frequency of 2.6 GHz with a maximum turbo frequency of 3.3 GHz and features 20MB of L3 cache. The CPU fits the FCLGA2011 socket and has a thermal design power of 115W.
This processor suits administrators maintaining existing dual-socket servers that require FCLGA2011 compatibility and DDR3 1600 memory support. It provides 16 threads for virtualisation workloads and supports PCI Express 3.0 connectivity. It does not suit builders assembling new systems or those requiring higher memory speeds, newer instruction sets, or lower power envelopes.
The single specification that decides compatibility is the FCLGA2011 socket paired with the integrated DDR3 1600 memory controller. The motherboard must provide this exact socket and support DDR3 memory at this speed. Cooling is not included, so a suitable 115W thermal solution must be sourced separately.
| Brand | Intel |
|---|---|
| Series | Xeon |
| Name | Xeon E5-2670 |
| Model | CM8062101082713 |
| CPU Socket Type | FCLGA2011 |
| Core Name | Sandy Bridge-EP |
| # of Cores | 8-Core |
| # of Threads | 16 |
| Operating Frequency | 2.6 GHz |
| Max Turbo Frequency | 3.3 GHz |
| L2 Cache | 8 x 256KB |
| L3 Cache | 20MB |
| 64-Bit Support | Yes |
| Hyper-Threading Support | Yes |
| Manufacturing Tech | 32 nm |
| Integrated Memory Controller Speed | DDR3 1600 |
| Virtualization Technology Support | Yes |
| PCI Express Revision | PCI Express 3.0 |
| Thermal Design Power | 115W |
| Cooling Device | Cooling device not included - Processor Only |
| 出貨重量 | 0.45 kg |
| 包裝尺寸 | 203 × 127 × 102 mm |
The 8 cores and 16 threads run at 2.6 GHz base frequency, scaling to 3.3 GHz max turbo when thermal headroom allows, delivering consistent throughput for virtualisation and database tasks.
The processor provides PCI Express 3.0 lanes, capping each lane at 8 GT/s; total lane count depends on the motherboard chipset, so check the board specification for slot allocation.
The FCLGA2011 socket uses the standard ILM pattern with 80 mm × 80 mm screw spacing; a cooler rated for at least 115 W TDP and compatible with narrow-ILM brackets is needed.
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