Kingston Technology Corp. KSM26SED8/32HC 32GB DDR4 2666 CL19 ECC Unbuffered 260-pin SO-DIMM server RAM
- 32GB
- 260-Pin DDR4 SO-DIMM
Kingston Technology Corp.
16 GB DDR4 2666 ECC SO-DIMM module with CL19 latency for servers and workstations
Capacity 16GB
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Rank 1Rx8
Option Hynix
This 16 GB unbuffered ECC module runs at 2666 MHz with CL19 latency on a 260-pin SO-DIMM form factor. It targets administrators and integrators who need error-correcting memory for servers, NAS appliances or mobile workstations. The single-rank design keeps electrical loading low for dense configurations.
At 1.20 V the module draws minimal power and generates little heat, helping keep chassis temperatures down in 1U or compact NAS enclosures. No heat spreader is fitted, so airflow across the PCB handles cooling silently. The RoHS, REACH and WEEE certifications confirm restricted-substance compliance.
Kingston lists specific compatibility with Fujitsu Celsius H7510 mobile workstations, Supermicro X12SCV-LVDS and X570D4I-2T boards, ASRock 1U Open19 and 1U2-X570/2T servers, ASUS ProArt StudioBook and Lockerstor models, MSI WE and WS series workstations, plus QNAP TS and Synology DiskStation and RackStation units. Intel XMP 2.0 support allows automatic timing configuration on enabled platforms. Builders needing registered DIMMs or higher capacities must look elsewhere.
| Brand | Kingston |
|---|---|
| Model | KSM26SES8/16HC |
| Capacity | 16GB |
| Type | 260-Pin DDR4 SO-DIMM |
| Speed | DDR4 2666 (PC4 21300) |
| CAS Latency | CL19 |
| Voltage | 1.20V |
| ECC | Yes |
| Buffered/Registered | Unbuffered |
| Rank | 1Rx8 |
| BIOS/Performance Profile | Intel XMP 2.0 |
| Heat Spreader | No |
| 出貨重量 | 0.01 kg |
| 包裝尺寸 | 69 × 38 × 8 mm |
其他版本
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Align the notch on the module with the slot key, insert at an angle, then press down firmly until both side clips click. The step often missed is verifying both clips have fully engaged.
No routine maintenance is required. Replace only if memory errors appear or capacity becomes insufficient for the workload.
The CL19 latency and 2666 MHz speed ceiling will limit throughput before the 1.20V voltage or thermal envelope becomes a constraint.
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