BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
KLEVV
8 GB DDR4 SODIMM running at 3200 MHz with CL22 latency for faster laptop performance
This 8 GB module uses SK Hynix chips on a 260-pin SO-DIMM PCB and runs at 3200 MHz with CL22 timings. It targets owners of compatible notebooks who want a straightforward capacity increase without opening a desktop chassis. The single-stick layout keeps one slot free for future expansion. JEDEC 1.2 V operation means no manual voltage tuning is required.
At the rated 22-22-22-51 latency the stick delivers steady bandwidth for long rendering, compilation or virtual-machine sessions. Because it follows the PC4-25600 JEDEC profile, the memory controller does not need to down-clock during extended use. Thermal throttling is unlikely in typical laptop cooling envelopes. XMP 2.0 is present but only activates on platforms that expose the profile in firmware.
The matte-black PCB resists fingerprints during installation and fits the standard 260-pin slot found in most modern notebooks. Non-ECC unbuffered organisation matches the majority of consumer laptop memory controllers. QVL testing covers Intel 400-series and AMD AM4/TR4 platforms including Ryzen 3/5/7/9 and Threadripper families. No heatsink or RGB elements add height, so clearance inside thin chassis is preserved.
| CAS Latency | CL22 |
|---|---|
| Option | 22-22-22-51 |
The module runs at the standard 1.2 V JEDEC voltage, so power draw and heat stay within normal laptop DDR4 limits.
Your laptop needs a free DDR4 SODIMM slot that accepts 260-pin modules and supports 3200 MHz operation.
Yes, it will down-clock to match the slower 2666 MHz modules while keeping CL22 timings.
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