NEMIX RAM 256GB (8x32GB) DDR3 1600 ECC RDIMM server RAM
- 256GB (8 x 32GB)
- 240-Pin DDR3 RDIMM
NEMIX RAM
A 128 GB registered ECC DDR4 kit of four 32 GB modules running at 3200 MT/s with CL22 latency at 1.2 V
Capacity 128GB (4 x 32GB)
This 128GB kit contains four 32GB registered DIMMs built for servers and workstations that require error-correcting memory. Each module runs at DDR4 3200 with CL22 latency and 1.20V operation. The 2Rx8 organisation and registered buffer suit multi-socket platforms needing high capacity per channel.
Modules use Samsung, Micron or Hynix components selected for enterprise workloads. Every stick is stress tested under load before shipping. The supplier backs the kit with a lifetime replacement warranty and US-based IT support staff. No heat spreaders are fitted, leaving a low-profile form factor for dense chassis.
Installation follows standard RDIMM procedure: power down, open the chassis, align the keyed 288-pin edge connector and press until the latches click. The most common issue is mixing registered and unbuffered DIMMs or populating slots in the wrong order for the specific motherboard. Always consult the system manual for the approved population sequence.
| Brand | NEMIX RAM |
|---|---|
| Series | NEMIX RAM Original Series Memory |
| Model | DDR4 ECC RDIMM Registered Server Memory |
| Part Number | MR25600-328K4 |
| Capacity | 128GB (4 x 32GB) |
| Type | 288-Pin DDR4 RDIMM |
| Speed | DDR4 3200 (PC4 25600) |
| CAS Latency | CL22 |
| Voltage | 1.20V |
| ECC | Yes |
| Buffered/Registered | Registered |
| Rank | 2Rx8 |
| Chipset | Major OEM Samsung, Micron, Hynix |
| Heat Spreader | No |
| Features | DDR4 ECC RDIMM Registered Server Memory Motherboard Compatible |
其他版本
同系列產品,記憶體、散熱器或時脈不同 — 下單前請先比較。
The modules are solid-state with no moving parts, so no scheduled maintenance or replacement is needed under normal server operation.
The 3200 MT/s bus sets the peak bandwidth ceiling, while CL22 determines the minimum access delay; the bus limit appears first in continuous workloads.
Each module runs at 1.20 V without a heat spreader, so total power draw stays low and passive chassis airflow is usually sufficient for cooling.
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