NEMIX RAM 128GB (8x16GB) DDR4 2933 CL21 1.2V 288-Pin UDIMM Kit
- 128GB (8 x 16GB)
- 288-Pin DDR4 UDIMM
NEMIX RAM
Eight 16 GB DDR4 ECC UDIMM modules at 2933 MT/s, CL21, 1.2 V, 2Rx8 for server workloads
Capacity 128GB (8 x 16GB)
This kit provides 128GB of DDR4 2933 ECC unbuffered memory across eight 16GB modules. It is built for servers and workstations that require error-correcting code to maintain data integrity under sustained loads. The 2Rx8 organisation and 1.2V operation suit standard UDIMM slots in compatible platforms. IT professionals choose this capacity for virtualisation hosts and database nodes.
Each module uses Samsung Micron or Hynix components selected for enterprise workloads. The lack of a heat spreader keeps the profile low for dense chassis while the unbuffered design reduces latency compared to registered alternatives. ECC functionality detects and corrects single-bit errors without additional software. Rigorous stress testing under load is performed before shipment to verify stability.
The 288-pin DDR4 modules install in minutes by seating each stick firmly until the retention clips engage. Populating all eight slots requires a motherboard that supports this total capacity and the 2933 speed at CL21. Boot failures usually mean the firmware needs an update or the slots must be filled in a specific sequence documented by the board vendor.
| Brand | NEMIX RAM |
|---|---|
| Series | NEMIX RAM Original Series Memory |
| Model | DDR4 ECC Unbuffered UDIMM Memory |
| Part Number | ME23400-628K8 |
| Capacity | 128GB (8 x 16GB) |
| Type | 288-Pin DDR4 ECC UDIMM |
| Speed | DDR4 2933 (PC4 23400) |
| CAS Latency | CL21 |
| Voltage | 1.20V |
| ECC | Yes |
| Buffered/Registered | Unbuffered |
| Rank | 2Rx8 |
| Chipset | Major OEM Samsung, Micron, Hynix |
| Heat Spreader | No |
| Features | DDR4 ECC Unbuffered UDIMM Motherboard Compatible |
其他版本
同系列產品,記憶體、散熱器或時脈不同 — 下單前請先比較。
DDR4 ECC UDIMM memory does not wear out from write cycles; the modules only need replacement if a hardware fault occurs or capacity requirements change.
The CL21 timing at 2933 MHz sets the access latency; under continuous load the memory controller waits for each CAS cycle, so latency is the first limit reached.
Each module operates at 1.20 V with no heat spreader; total power draw is low enough that standard chassis airflow keeps temperatures within normal DDR4 limits.
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