BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
NEMIX RAM
32 GB DDR4 2133 ECC LRDIMM server memory module with CL15 latency and 1.2 V operation
This 32GB DDR4 2133 PC4-17000 module is built for servers and workstations that require ECC registered memory. It operates at 1.2V with a CL15 latency and a 4Rx4 organisation. The load-reduced design helps maintain signal integrity on heavily populated motherboards. It targets IT professionals upgrading compatible Hynix platforms.
The stick uses a 288-pin DIMM edge connector and ships as a single 32GB unit, so no pairing is required. A heat spreader is not fitted, which keeps the profile low for dense chassis. The package contains only the memory module itself; no additional cables, brackets or software licences are included. Installation follows standard DIMM procedures outlined in the system manual.
The 4Rx4 rank configuration combined with load-reduced buffering is the specification that determines whether this module will work in a given server. Systems that expect standard registered DIMMs or a different rank count will not accept it. Verify the motherboard qualification list for 4Rx4 LRDIMM support before purchase. Builders needing unbuffered or non-ECC memory cannot use this part.
| Brand | NEMIX RAM |
|---|---|
| Series | Hynix Server/Workstaion Compatible Series Memory |
| Model | Hynix DDR4 2133MHZ ECC LRDIMM Load Reduced Server Memory |
| Part Number | ML17000-344K1 |
| Capacity | 32GB |
| Speed | DDR4 2133 (PC4 17000) |
| ECC | Yes |
| Buffered/Registered | Load Reduced |
| Chipset | Major OEM Samsung, Micron, Hynix |
| Voltage | 1.20V |
| Compatible System | Hynix |
| CAS Latency | CL15 |
| Heat Spreader | No |
| Type | 204-Pin DDR3 SODIMM |
| Rank | 4Rx4 |
| Features | DDR4 ECC LRDIMM Load Reduced Server Motherboard Compatible |
| Package Content | 32GB (1X32GB) DDR4 2133MHZ PC4-17000 4Rx4 1.2V CL15 288-PIN ECC LRDIMM Load Reduced Server Memory |
The 4Rx4 organization is fixed on this 32GB module; no firmware governs rank structure, so replacement is only needed if a slot fails or capacity must change.
The memory controller's maximum supported load-reduced rank count per channel is reached before bandwidth or thermal limits at 1.20 V.
At 1.20 V the DRAM draws minimal power; without a heat spreader the PCB runs warm but within normal server airflow limits.
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