BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
NEMIX RAM
A 64 GB DDR4 2666 kit of two 32 GB UDIMMs built for the Supermicro MBD-C9Z390CG-IW
This 64 GB kit supplies two 32 GB UDIMM modules validated for the Supermicro MBD-C9Z390CG-IW motherboard. It runs at DDR4 2666 with CL19 timings and 1.20 V, using 2Rx8 non-ECC unbuffered chips from major OEM suppliers.
The modules use the standard 288-pin DDR4 UDIMM layout and ship as a tested pair, so they install directly into the board's memory slots without extra cables, brackets or software. The matched configuration enables dual-channel operation for the platform.
Confirm the motherboard has two available DDR4 UDIMM slots and that the BIOS accepts 32 GB non-ECC unbuffered modules at 2666 MT/s. Systems limited to lower densities, registered memory only, or a different memory generation cannot use this kit.
| Brand | NEMIX RAM |
|---|---|
| Series | SuperMicro Server/Workstation Compatible Series Memory |
| Model | Supermicro DDR4 2666MHZ Non-ECC Unbuffered UDIMM |
| Part Number | MD21300-328K2 |
| Capacity | 64GB (2 x 32GB) |
| Speed | DDR4 2666 (PC4 21300) |
| ECC | No |
| Buffered/Registered | Unbuffered |
| Chipset | Major OEM Samsung, Micron, Hynix |
| Voltage | 1.20V |
| Compatible System | Supermicro |
| CAS Latency | CL19 |
| Heat Spreader | No |
| Type | 288-Pin DDR4 UDIMM |
| Rank | 2Rx8 |
| Features | DDR4 Non- ECC Unbuffered UDIMM Motherboard Compatible |
| Package Content | 64GB (2X32GB) DDR4 2666MHZ PC4-21300 2Rx8 1.2V CL19 288-PIN Non-ECC Unbuffered UDIMM KIT |
No firmware is involved with these unbuffered DDR4 UDIMMs; the 2Rx8 organisation is handled by the memory controller. If a module ever needs re-seating, power down, remove and re-insert the 288-pin sticks.
The CAS latency of CL19 at 1.20 V sets the timing envelope; sustained throughput is bounded by the DDR4 2666 (PC4-21300) data rate rather than thermal throttling.
Each module operates at the standard DDR4 1.20 V without a heat spreader, so power draw stays at the JEDEC baseline for 2666 MT/s and the bare PCB dissipates heat passively.
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