BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
NEMIX RAM
A 768 GB DDR5 registered ECC kit of six 128 GB modules running at 6400 MT/s with CL52 latency and 1.1 V, validated for the Supermicro H14DSG-O-CPU motherboard
This 768GB kit delivers six 128GB DDR5 6400 RDIMM modules built to the exact rank, voltage and timing the Supermicro H14DSG-O-CPU motherboard expects. Registered ECC architecture offloads the memory controller so every slot runs fully populated at rated speed while correcting single-bit errors on the fly.
Swapping smaller RDIMM kits for this 6x128GB configuration maximises the board's supported capacity in a single upgrade step. The jump is worth it when workloads need more simultaneous threads or larger in-memory datasets than the current population allows.
Six 128GB dual-rank modules provide the headroom for virtualisation clusters, large database buffers and high-throughput compute jobs that scale with memory bandwidth. Headroom runs out when the platform's maximum supported DIMM count or per-channel limit is reached, so verify the manual before adding more.
| Brand | NEMIX RAM |
|---|---|
| Series | NEMIX RAM Original Series Server Memory |
| Model | DDR5 ECC RDIMM Registered Server Memory |
| Part Number | MR51200-724K6 |
| Capacity | 768GB (6 x 128GB) |
| Type | 288-Pin DDR5 RDIMM |
| Speed | DDR5 6400 (PC5 51200) |
| CAS Latency | CL52 |
| Voltage | 1.10V |
| ECC | Yes |
| Buffered/Registered | Registered |
| Rank | 2Rx4 |
| Chipset | Major OEM Samsung, Micron, Hynix |
| Heat Spreader | No |
| Compatible System | Supermicro |
| Features | DDR5 ECC RDIMM Motherboard Compatible |
| Package Content | 768GB 6X128GB DDR5 6400MHz PC5-51200 2Rx4 1.1V 288-PIN ECC RDIMM KIT |
Yes, the kit uses the 288-pin Registered RDIMM form factor that the H14DSG-O-CPU requires; it is not a UDIMM or SODIMM.
Consult the Supermicro H14DSG-O-CPU manual for the approved DIMM population sequence before installing all six modules.
The modules ship without a heat spreader; adequate chassis airflow is required to keep the 1.1V DRAM within thermal limits.
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