OWC 128GB DDR4 3200 CL22 4Rx4 ECC LRDIMM 288-pin memory upgrade
- 128GB
- 288-Pin DDR4 ECC LR…
OWC
A 128GB DDR4 3200 ECC load-reduced DIMM for compatible Gigabyte server and workstation platforms
This 128GB DDR4 module runs at 3200MHz with CL22 latency and 1.2V operation. It uses a 288-pin load-reduced form factor with 4Rx4 organisation and built-in ECC. The memory is designed for Gigabyte H262-P60, H262-P61, H262-PC0, H262-PC1 and H262-PC2 server and workstation platforms.
The load-reduced design reduces electrical load on the memory bus, allowing this 128GB capacity in a single DIMM. It cannot be mixed with unbuffered or standard registered ECC modules. The module is backward compatible with 2133MHz, 2400MHz, 2666MHz and 2933MHz bus speeds. No heat spreader is fitted, relying on chassis airflow.
This memory fits only systems that support DDR4 ECC load-reduced DIMMs. Standard desktop motherboards and consumer laptops will not accept it. The 288-pin interface is keyed differently from unbuffered or registered DIMMs, preventing incorrect installation. Maximum capacity per channel depends on the specific platform memory controller.
| Brand | OWC |
|---|---|
| Part Number | 3L2D44R4128G |
| Capacity | 128GB |
| Type | 288-Pin DDR4 ECC LRDIMM |
| Speed | DDR4 3200 (PC4 25600) |
| CAS Latency | 22 |
| Voltage | 1.2V |
| ECC | Yes |
| Buffered/Registered | Load Reduced |
| Rank | 4Rx4 |
| Heat Spreader | No |
| Compatible System | Gigabyte H262-P60 Gigabyte H262-P61 Gigabyte H262-PC0 Gigabyte H262-PC1 Gigabyte H262-PC2 |
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No firmware updates or component replacements are required for the 128GB DDR4 3200 ECC LRDIMM; the module is a solid-state component with no moving parts and is designed to operate for the lifetime of the compatible Gigabyte H262 series systems.
The primary limit under sustained full load is the JEDEC-defined maximum operating temperature for the DDR4 DRAM chips; the module has no heat spreader, so chassis airflow must keep the chips within specification.
The module operates at 1.2V with a 4Rx4 load-reduced design; power draw scales with capacity and rank count, and waste heat is dissipated directly from the DRAM packages into the server's forced-air cooling path.
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