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Green circuit board with black memory chips, gold edge connector, thin rectangular SODIMM form factor

OWC

OWC 16GB DDR4 3200MHz CL22 1.2V 260pin SODIMM HP 470 G9 memory upgrade

SKU CH-6VH9-79Y0W

16GB DDR4 3200MHz CL22 SODIMM adds responsive multitasking to HP 470 G9

  • Capacity16GB
  • Type260-Pin DDR4 Non-ECC SODIMM
  • SpeedDDR4 3200 (PC4 25600)
  • CAS LatencyCL22
  • Voltage1.2V
  • ECCNo
  • 16 GB DDR4 3200 MHz boosts multitasking responsiveness
  • CL22 latency at 1.2 V keeps power draw low
  • 260-pin SODIMM fits HP 470 G9 slots directly
  • JEDEC compliant build ensures warranty safe upgrade
  • 2Rx8 unbuffered design delivers stable dual rank performance

Compatible 16GB DDR4 SODIMM for HP 470 G9

This OWC module provides 16GB of DDR4 memory at 3200MHz with CL22 latency. It uses the 260-pin SODIMM form factor and operates at 1.2V. The kit is designed specifically for the HP 470 G9 laptop.

Verify slot count and current configuration

Check how many SODIMM slots your HP 470 G9 has and whether they are occupied. Confirm the existing memory runs at 3200MHz and uses 1.2V non-ECC DDR4. Matching capacity, speed, and voltage ensures stable dual-channel operation.

Low-voltage operation keeps thermals modest

At 1.2V the module draws minimal power and generates little heat during typical workloads. No heat spreader is fitted, relying on the laptop's internal airflow. Silent operation is maintained as there are no moving parts.

商品特色

  • 16 GB DDR4 3200 MHz boosts multitasking responsiveness
  • CL22 latency at 1.2 V keeps power draw low
  • 260-pin SODIMM fits HP 470 G9 slots directly
  • JEDEC compliant build ensures warranty safe upgrade
  • 2Rx8 unbuffered design delivers stable dual rank performance

商品規格

BrandOWC
Part Number3S2D42R816GB
Capacity16GB
Type260-Pin DDR4 Non-ECC SODIMM
SpeedDDR4 3200 (PC4 25600)
CAS LatencyCL22
Voltage1.2V
ECCNo
Buffered/RegisteredUnbuffered
Rank2Rx8
Heat SpreaderNo
Compatible SystemHP 470 G9

其他版本

同系列還有 5 款

同系列產品，記憶體、散熱器或時脈不同 — 下單前請先比較。

商品問答

Does the 260-pin SODIMM ship alone or with any tools or brackets?

The module is supplied as a single 16 GB DDR4 3200 MHz CL22 stick; no tools, brackets or additional parts are included.

Should I pick the 16 GB CL22 version or a different capacity for the HP 470 G9?

This part number is the 16 GB 3200 MHz CL22 variant tested for the 470 G9; other capacities or latencies would be separate part numbers.

Will the PC4-25600 rating run at 3200 MHz inside the 470 G9 without BIOS changes?

The SODIMM is JEDEC-standard DDR4 3200 CL22 at 1.2 V, so the 470 G9 will configure it at its rated speed automatically.

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