OWC 4GB DDR4 2400 CL17 1.2V 260pin SODIMM HP OMEN X 17-ap series
- 4GB
- 260-Pin DDR4 Non-EC…
OWC
4GB DDR4 2400 SODIMM upgrades compatible HP Pavilion Power 15-cb laptops
This 4GB DDR4 2400MHz SODIMM module is built for HP Pavilion Power 15-cb series laptops. It installs in a 260-pin slot and runs at 1.2V with CL17 latency. The module is unbuffered, non-ECC and organised as a single-rank 1Rx8 device. No heat spreader is fitted.
Builders who need a higher total capacity or a matched pair of modules should look elsewhere. Systems that require ECC or registered memory cannot use this stick. The single 4GB capacity limits multitasking headroom for heavy workloads.
The module conforms to the PC4-19200 JEDEC standard and is tested for the five listed HP Pavilion Power models. Speed, voltage, latency and pin count together decide whether the part will be recognised and run stably in the target laptop.
| Brand | OWC |
|---|---|
| Part Number | 2S4D41R804GB |
| Capacity | 4GB |
| Type | 260-Pin DDR4 Non-ECC SODIMM |
| Speed | DDR4 2400 (PC4 19200) |
| CAS Latency | CL17 |
| Voltage | 1.2V |
| ECC | No |
| Buffered/Registered | Unbuffered |
| Rank | 1Rx8 |
| Heat Spreader | No |
| Compatible System | HP Pavilion Power 15-cb070ng HP Pavilion Power 15-cb070nz HP Pavilion Power 15-cb075nr HP Pavilion Power 15-cb081no HP Pavilion Power 15-cb083nd |
其他版本
同系列產品,記憶體、散熱器或時脈不同 — 下單前請先比較。
Power off the laptop and disconnect the battery if accessible. Locate the memory compartment, release any retaining screws, and align the notch on the module with the key in the slot. Insert evenly and press down until the side clips engage automatically.
No scheduled maintenance is required for this non-ECC unbuffered SODIMM. The module has no heat spreader or moving parts. Replacement is only necessary if a memory test reports errors or if you upgrade to a higher capacity configuration.
The 4GB capacity ceiling is reached before thermal or voltage limits become a factor. With a single 1Rx8 rank at 1.2V and no heat spreader, the module stays within JEDEC thermal limits, but multitasking headroom is defined by the 4GB size.
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