OWC 64GB (4x16GB) DDR3 1333 ECC Registered RDIMM for HP DL320 DL360 DL380 ML330 ML350 memory upgrade
- 64GB (4 x 16GB)
- 240-Pin DDR3 ECC RD…
OWC
64 GB DDR3L ECC registered kit in four 16 GB modules at 1600 MHz for Lenovo Flex System x280 X6, x480 X6 and x880 X6 servers
Capacity 64GB (4 x 16GB)
This OWC upgrade kit delivers 64GB of DDR3L 1600 registered ECC memory across four 16GB modules. It is built for Lenovo Flex System x280 X6, x480 X6 and x880 X6 servers that require 240-pin RDIMMs with 2Rx4 organisation. The modules operate at 1.35V and carry CL11 latency. They are not compatible with standard desktop platforms or unbuffered memory configurations.
Each module runs at the DDR3L 1.35V specification, reducing power draw compared to standard 1.5V DDR3 while maintaining 1600MHz throughput. Registered buffering places less electrical load on the server memory controller, helping sustain stability in fully populated slots. No heat spreaders are fitted, so airflow across the DIMMs follows the chassis design of the supported Flex System nodes.
The kit replaces Lenovo part numbers 0C19535, 46W0671 and 46W0672, simplifying procurement for existing fleets. Modules are validated to JEDEC and RoHS standards and backed by OWC’s advanced replacement programme with lifetime technical support. No additional software or accessories are included; the value is in verified compatibility and warranty coverage for the listed server models.
| Brand | OWC |
|---|---|
| Part Number | 1R6T32R4064S |
| Capacity | 64GB (4 x 16GB) |
| Type | 240-Pin DDR3L ECC RDIMM |
| Speed | DDR3L 1600 (PC3L 12800) |
| CAS Latency | CL11 |
| Voltage | 1.35V |
| ECC | Yes |
| Buffered/Registered | Registered |
| Rank | 2Rx4 |
| Heat Spreader | No |
| Compatible System | Lenovo Flex System x280 X6 Lenovo Flex System x480 X6 Lenovo Flex System x880 X6 |
其他版本
同系列產品,記憶體、散熱器或時脈不同 — 下單前請先比較。
Power down, open the chassis, align each module notch with the slot key, press firmly until the retention clips click, then verify all four 16GB modules appear at 1600 MHz in the BIOS; the step often missed is seating every clip fully before closing the cover.
The modules have no heat spreaders and no moving parts, so no scheduled maintenance is required; replacement is only necessary if a DIMM fails, which the ECC logic will flag in system logs.
The registered buffer and CL11 latency set the throughput ceiling, so memory bandwidth saturates before the 1.35V thermal envelope becomes a constraint.
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