OWC 2S4D42R808GB 8GB DDR4 2400 CL17 SODIMM HP Pavilion 24-r041a/50/51/52
- 8GB
- 260-Pin DDR4 Non-EC…
OWC
8GB DDR4 SODIMM running at 2400MHz CL17 for HP x360 11-ab series laptops
This 8 GB SODIMM is built for the HP x360 11-ab series including the 11-ab104nf, 11-ab106nb, 11-ab122tu, 11-ab162nd and 11-ab192ng. It adds memory capacity to a compact convertible that ships with limited RAM. The module follows the JEDEC DDR4 2400 standard so it fits the factory slot without modification. It is not for systems that require ECC or registered memory.
The module runs at the standard 1.2 V DDR4 voltage and has no heat spreader. At the rated 2400 MT/s speed the power draw stays within the JEDEC envelope for a 260-pin SO-DIMM. Because the x360 11-ab chassis relies on passive or low-flow cooling the stick produces minimal extra heat during typical office or web workloads. Acoustic impact is negligible as the memory itself has no moving parts.
Under continuous multi-tasking the CL17 latency and 2Rx8 organisation keep timings stable at 2400 MT/s. The JEDEC compliance and OWC lab validation mean the module maintains rated speed without throttling during long sessions. Backward compatibility with 2133 MT/s platforms allows it to down-clock cleanly if the system firmware demands it. It will not suit workloads that need ECC error correction or higher frequencies than 2400 MT/s.
| Brand | OWC |
|---|---|
| Part Number | 2S4D42R808GB |
| Capacity | 8GB |
| Type | 260-Pin DDR4 Non-ECC SODIMM |
| Speed | DDR4 2400 (PC4 19200) |
| CAS Latency | CL17 |
| Voltage | 1.2V |
| ECC | No |
| Buffered/Registered | Unbuffered |
| Rank | 2Rx8 |
| Heat Spreader | No |
| Compatible System | HP x360 11-ab104nf HP x360 11-ab106nb HP x360 11-ab122tu HP x360 11-ab162nd HP x360 11-ab192ng |
其他版本
同系列產品,記憶體、散熱器或時脈不同 — 下單前請先比較。
Power off the laptop and disconnect the battery if accessible, then insert the module at an angle into the slot until the side clips click; the step people skip is fully seating both clips so the stick sits flat.
No routine maintenance is required; the module has no heat spreader or moving parts, so it only needs replacement if a fault develops or you later want more capacity.
The CL17 latency at 2400MHz sets the throughput ceiling; the memory controller will not push data faster than the rated speed, so bandwidth caps before temperature becomes an issue.
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