OWC 8GB DDR4 2400MHz CL17 1.2V 288pin UDIMM for HP Pavilion 570
- 8GB
- 288-Pin DDR4 Non-EC…
OWC
An 8 GB DDR4 2400 MHz CL17 UDIMM upgrade for HP Pavilion 570 desktop models
This 8 GB DDR4-2400 UDIMM is built for HP Pavilion 570-p044nz, 570-p045ng, 570-p045xt, 570-p049 and 570-p049ng desktops. It installs in a standard 288-pin slot and runs at 1.2 V without ECC or buffering. The module suits owners of those specific models who need a straightforward capacity increase.
The memory complies with JEDEC DDR4 specifications and operates at the rated 2400 MHz CL17 without requiring voltage increases. Standard 1.2 V draw keeps power consumption low and heat output minimal, so no heat spreader is fitted. Backward compatibility with 2133 MHz systems allows the same module to run at the lower speed if the platform demands it.
OWC provides a limited lifetime warranty with an advanced replacement programme and free technical support. An online installation video walks through the DIY fitting process for the listed HP Pavilion models. The package contains only the memory module; no additional cables, brackets or software licences are included.
| Brand | OWC |
|---|---|
| Part Number | 2U4D42R808GB |
| Capacity | 8GB |
| Type | 288-Pin DDR4 Non-ECC UDIMM |
| Speed | DDR4 2400 (PC4 19200) |
| CAS Latency | CL17 |
| Voltage | 1.2V |
| ECC | No |
| Buffered/Registered | Unbuffered |
| Rank | 2Rx8 |
| Heat Spreader | No |
| Compatible System | HP Pavilion 570-p044nz HP Pavilion 570-p045ng HP Pavilion 570-p045xt HP Pavilion 570-p049 HP Pavilion 570-p049ng |
其他版本
同系列產品,記憶體、散熱器或時脈不同 — 下單前請先比較。
Power off, unplug, open the case, align the notch on the module with the slot key, press firmly until both retention clips click — the step often missed is fully seating both ends so the clips lock automatically.
No routine maintenance is required; the module has no heat spreader and no moving parts, so replacement is only needed if a fault develops or you upgrade capacity later.
The CAS latency of CL17 at 2400MHz sets the timing ceiling; sustained workloads hit that latency bound before voltage or thermal limits become a factor.
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