OWC 2U6D41R808GB 8GB DDR4 2666 CL19 1.2V 288-Pin UDIMM memory upgrade
- 8GB
- 288-Pin DDR4 Non-EC…
OWC
8GB DDR4 3200 SODIMM upgrades HP EliteBook 855 G8 with CL22 timing and 1.2V operation
This 8 GB DDR4 module is built to the exact specifications of the HP EliteBook 855 G8. It targets owners of that laptop who need more memory for everyday multitasking and larger workloads. The part number 3S2D41R808GB identifies the validated configuration.
The stick uses a standard 260-pin SODIMM edge connector and requires no tools beyond a screwdriver to access the laptop's memory slot. It draws 1.2 V and operates at DDR4 3200 (PC4-25600) with CL22 timing. Because it is non-ECC and unbuffered, it fits the platform's native memory controller without extra configuration.
Every module is tested to meet JEDEC standard specifications and ROHS compliance, ensuring stable voltage and timing during extended sessions. The single-rank 1Rx8 organisation helps maintain consistent throughput when multiple applications remain open for long periods. No heat spreader is fitted, so the laptop's existing cooling handles thermal load.
| Brand | OWC |
|---|---|
| Part Number | 3S2D41R808GB |
| Capacity | 8GB |
| Type | 260-Pin DDR4 Non-ECC SODIMM |
| Speed | DDR4 3200 (PC4 25600) |
| CAS Latency | CL22 |
| Voltage | 1.2V |
| ECC | No |
| Buffered/Registered | Unbuffered |
| Rank | 1Rx8 |
| Heat Spreader | No |
| Compatible System | HP EliteBook 855 G8 |
其他版本
同系列產品,記憶體、散熱器或時脈不同 — 下單前請先比較。
The module operates at CL22 latency, which is the JEDEC standard timing for DDR4 3200 SODIMMs.
No heat spreader is fitted; at the standard 1.2 V the SODIMM runs within normal laptop thermal limits without additional cooling.
This 8 GB DDR4 3200 SODIMM is validated for the HP EliteBook 855 G8.
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