BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
SAMSUNG
16 GB DDR4 SODIMM module in a single 16 GB rank configuration at 3200 MHz with CL22 latency and 1.2 V operation
This is a 16 GB DDR4 SODIMM module built for laptop upgrades. It uses the 260-pin layout and runs at 3200 MHz with a CAS latency of 22. The stick operates at 1.2 V and is organised as a dual-rank 2Rx8 part.
Buyers adding memory to a notebook that accepts DDR4 SODIMMs at this speed will find a direct fit. Systems limited to 8 GB maximum capacity or those requiring ECC registered modules cannot use this stick.
The single figure that determines fit is the 3200 MHz DDR4 rating paired with the 260-pin SODIMM form factor; if the laptop specifies a different memory type or speed grade this module will not be compatible.
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Yes, the module will operate at the lowest common speed supported by the system and the existing memory.
Check the memory speed and latency in the system BIOS or a tool such as CPU-Z; they should report 3200MHz and CL22 when the module is the only one installed.
The package contains the single 16GB 260-pin SODIMM module; no tools, adapters or additional components are included.
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