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Green printed circuit board with black memory chips and gold edge connector

SAMSUNG

SAMSUNG 1GB PC3200 CL3 64MX8 PB desktop RAM

SKU CH-1Y52-V0FR6

A 1 GB DDR desktop module rated PC3200 with CL3 latency and 64Mx8 chip organisation

  • Capacity1GB
  • CAS LatencyCL3
  • 1GB capacity for everyday desktop tasks
  • CL3 latency for responsive memory access
  • PC3200 DDR rating for standard system compatibility
  • 64MX8 chip organisation for reliable data handling
  • Brand-new Samsung module manufactured to original specifications

Samsung 1GB PC3200 Desktop Memory

This Samsung desktop memory module provides 1GB of capacity with a CAS latency of CL3. It is a new component intended for systems that accept PC3200 specification memory. The module uses a 64MX8 chip organisation.

Suitable for legacy desktop upgrades

This module suits owners of older desktops that require PC3200 memory with CL3 timing. It is not for users who need more than 1GB per module or systems that demand a different CAS latency. Buyers with platforms that only support newer memory standards cannot use this part.

1GB capacity and CL3 timing

The decisive specification is the 1GB capacity combined with CL3 latency at the PC3200 rating. Verify that your motherboard accepts this exact capacity and timing before purchase.

商品特色

  • 1GB capacity for everyday desktop tasks
  • CL3 latency for responsive memory access
  • PC3200 DDR rating for standard system compatibility
  • 64MX8 chip organisation for reliable data handling
  • Brand-new Samsung module manufactured to original specifications

商品規格

Capacity1GB
CAS LatencyCL3

商品問答

Will the CL3 latency require any specific motherboard settings or future timing adjustments?

The module operates at CL3 latency as specified; no ongoing timing maintenance is needed once the system is stable.

What sustained-use limit appears first with this 1GB PC3200 module?

The 1GB capacity ceiling will be reached before bandwidth or latency limits under sustained workloads.

How much heat or noise does the 64MX8 chip arrangement produce during all-day operation?

Passive DRAM chips generate minimal heat and zero noise; standard case airflow is sufficient for continuous use.

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