BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
SAMSUNG
A 4 GB DDR3 SO-DIMM running at 1600 MHz with CL11 latency and 1.50 V operation
This 4GB DDR3 SO-DIMM runs at 1600 MHz with CL11 latency and 1.50V operation. It uses a 204-pin edge connector and unbuffered, non-ECC architecture. The module is suited to older notebooks that accept PC3-12800 memory.
Installation requires opening the laptop's memory compartment and pressing the stick into the SO-DIMM slot until the side clips engage. The keyed notch prevents backwards insertion. The most common issue is a loose fit if the clips do not fully latch, causing the system to fail POST.
Samsung chips on this module maintain rated 1600 MHz speeds under sustained read and write cycles. The 1.50V supply keeps thermals predictable in confined laptop chassis. Performance remains consistent without the throttling sometimes seen in lower-grade ICs during long sessions.
| Capacity | 4GB |
|---|---|
| Type | 204-Pin DDR3 SO-DIMM |
| Speed | DDR3 1600 (PC3 12800) |
| Voltage | 1.50V |
| ECC | No |
| Buffered/Registered | Unbuffered |
Open Task Manager or CPU-Z and check the memory tab; the speed should read 1600 MHz (PC3-12800) with CL11 timings at 1.50 V.
The box contains one 4 GB DDR3 204-pin SO-DIMM; you only need a laptop with a free DDR3 SO-DIMM slot.
Select this M471B5273CH0-CK0 module — it matches the 1600 MHz, CL11, 1.50 V specification exactly.
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