BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
SAMSUNG
512 MB DDR2 laptop SODIMM running at 533 MHz with CL4 latency and 1.8 V operation
This 512MB DDR2-533 module fits 200-pin SO-DIMM slots in older notebooks. It runs at PC2-4200 speed with CL4 latency and 1.80V operation. The unbuffered, non-ECC design matches mainstream laptop chipsets of the era. Buyers needing 1GB or more per slot cannot use this module.
At 1.80V the module draws modest power and produces little heat in normal office workloads. No active cooling is required on the stick itself; system airflow is sufficient. The CL4 timing keeps bus cycles tight without raising voltage. Builders seeking lower heat at higher frequencies will not find that combination here.
Eight chips in a 32x16 organisation deliver the rated density and timing. There is no bundled software, heat-spreader or installation tool. The bare circuit board is ready for direct slot insertion. Users wanting RGB lighting or monitoring utilities must look elsewhere.
| Brand | SAMSUNG |
|---|---|
| Model | M470T6554CZ3-CD5 |
| Capacity | 512MB |
| Type | 200-Pin DDR2 SO-DIMM |
| Speed | DDR2 533 (PC2 4300) |
| CAS Latency | CL4 |
| Voltage | 1.80V |
| ECC | No |
| Buffered/Registered | Unbuffered |
Align the notch on the module with the key in the slot, press firmly at both ends until the side clips snap shut, then verify the latch is fully engaged.
No routine maintenance is required; replacement is only necessary if the system becomes unstable or a larger capacity is desired.
The 512MB capacity ceiling is reached before thermal or latency limits become a factor.
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