BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
SAMSUNG
8GB DDR4 2666 SO-DIMM laptop memory module, CL19 unbuffered, 260-pin PC4-21300
This Samsung laptop memory module delivers 8 GB of DDR4 capacity in a 260-pin SO-DIMM form factor. It operates at 2666 MT/s with a CAS latency of 19 and is unbuffered and non-ECC. The module is new and intended for notebook memory upgrades.
Builders upgrading compatible notebooks or all-in-one PCs that take unbuffered, non-ECC DDR4 SO-DIMMs can use this module. It is not suitable for systems that require ECC memory, registered modules, or capacities other than 8 GB per module. Desktop DIMM slots and DDR5-only platforms cannot accept this part.
The decisive specification is the 260-pin DDR4 SO-DIMM interface combined with 2666 MT/s speed and CL19 timing. Verify that the target laptop supports DDR4 SO-DIMM memory at this speed before purchase.
| Brand | SAMSUNG |
|---|---|
| Model | M471A1K43DB1-CTD |
| Capacity | 8GB |
| Type | 260-Pin DDR4 SO-DIMM |
| Speed | DDR4 2666 (PC4 21300) |
| CAS Latency | CL19 |
| ECC | No |
| Buffered/Registered | Unbuffered / Unregistered |
This listing is for the single 8GB module; add one or two to match your laptop's slot count and desired total memory.
The module runs at DDR4 2666 with CL19 latency, delivering the standard JEDEC data rate for that frequency.
PC4-21300 is the JEDEC peak bandwidth designation for DDR4 2666, and the SO-DIMM uses the 260-pin DDR4 interface.
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