BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
SAMSUNG
16 GB DDR4 SODIMM at 3200 MHz CL22 cuts power draw by up to 40 % and lifts bandwidth by up to 30 % for longer battery life
This module provides 16 GB of DDR4 memory in a 260-pin SO-DIMM form factor. It operates at 3200 MHz with CL22 latency and runs at 1.2 V. The stick is unbuffered and non-ECC, designed for laptops and all-in-one PCs that accept DDR4 SO-DIMMs.
Builders whose systems have only one memory slot and support DDR4 3200 MHz SO-DIMMs can use this module to reach 16 GB total capacity. It is not for machines that require ECC or registered memory, nor for platforms limited to 8 GB maximum per slot or to earlier DDR generations.
The rated speed of 3200 MHz with CL22 timing at 1.2 V determines whether the memory matches the platform's supported specification. If the laptop's firmware or memory controller only validates lower speeds or different latencies, the module will downclock or may not post.
| Brand | SAMSUNG-Semiconductor |
|---|---|
| Capacity | 16GB |
| Type | 260-Pin DDR4 SO-DIMM |
| CAS Latency | CL22 |
| ECC | No |
| Buffered/Registered | Unbuffered / Unregistered |
| Heat Spreader | No |
PC4-25600 is the JEDEC designation for DDR4-3200, meaning the module transfers data at 3200 MT/s.
It fits a standard 260-pin DDR4 SO-DIMM socket used in laptops and all-in-one PCs; no heat spreader is present, so clearance is minimal.
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