BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
YINGHUA
H110 LGA1151 board with dual-channel DDR4, bundled G3900 CPU and thermal pad
This H110 board includes a pre-installed Intel G3900 processor and a thermal pad for immediate deployment. It accepts 6th, 7th and 8th generation LGA1151 CPUs up to 14 nm and provides dual-channel DDR4 memory support. The compact 19 x 17 cm PCB fits space-constrained server builds while delivering gigabit networking and multiple display outputs.
Two 240-pin DDR4 slots support up to 16 GB modules each at 2133, 2400 or 2666 MHz for a 32 GB ceiling. A single PCI Express x16 slot and one M.2 NVMe slot share the chipset's PCIe 3.0 bandwidth, so simultaneous high-throughput storage and graphics cards will contend for lanes. Four SATA ports and six USB ports (two 3.0, four 2.0) handle peripheral connectivity.
Bundling the G3900 and thermal pad removes the procurement step for entry-level server refreshes or thin-client roll-outs. The jump is worthwhile when you want a validated, low-power 14 nm platform without matching cooler clearances or verifying socket compatibility. Builders who need ECC memory, multiple x16 slots or higher core counts should look elsewhere.
| CPU Type | Intel Atom |
|---|
All four are listed as supported 14 nm LGA1151 processors; the G3900 is already included in the package, so no separate choice is required.
Two DDR4 slots accept up to 16 GB modules each at 2133, 2400 or 2666 MHz, giving 32 GB total for virtualisation or multi-tasking.
The board provides one M.2 NVMe slot and one PCI-E X16 slot; the M.2 slot handles NVMe storage directly, independent of the X16 graphics slot.
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