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Rectangular grey thermal pad 85 by 45 by 2.5 mm

Lirealar

Lirealar Extreme Odyssey Thermal Pad 12.8 W/mK 85x45x2.5mm

SKU CH-ATZB-BW0E3

High-conductivity 12.8 W/mK thermal pad sized 85 x 45 x 2.5 mm, non-conductive and reusable for GPU, CPU or laptop heatsinks

  • Thermal Conductivity12.8 W/mK

Size 85x45x2.5mm

Durchgestrichene Varianten existieren, sind hier aber nicht vorrätig.

  • High thermal conductivity of 12.8 W/mK for efficient heat transfer
  • Non-conductive silicone insulates components against electrical shorts
  • Non-corrosive and non-curing formula ensures long-term stability
  • Natural viscosity allows easy installation and reusability
  • 85 x 45 x 2.5 mm size fits laptop heatsinks, GPU and CPU coolers

Precision Fit for Tight Gaps

This thermal pad measures 85 by 45 by 0.5 millimetres and delivers 12.8 W/mK conductivity. It suits laptop heatsinks, GPU memory modules, CPU packages and LED coolers where a thin, compliant interface is required. The silicone construction stays flexible across a wide temperature range.

Non-Conductive Drop-In Layer

The material is electrically insulating, non-corrosive, non-curing and non-toxic, so it can bridge components and heatspreaders without risk of shorting. Natural tack holds the pad in place during assembly yet allows clean removal for rework. One pad covers multiple small dies or a single larger surface.

Step Up from Standard Silicone Pads

Builders replacing factory pads rated below 12.8 W/mK will see lower junction temperatures on memory and voltage-regulator zones. The upgrade is worthwhile when the original material has dried out or when a thinner 0.5 millimetre gap demands higher conductivity than typical stock pads provide.

Besonderheiten

  • High thermal conductivity of 12.8 W/mK for efficient heat transfer
  • Non-conductive silicone insulates components against electrical shorts
  • Non-corrosive and non-curing formula ensures long-term stability
  • Natural viscosity allows easy installation and reusability
  • 85 x 45 x 2.5 mm size fits laptop heatsinks, GPU and CPU coolers

Technische Daten

Thermal Conductivity12.8 W/mK

Andere Versionen dieses Modells

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Fragen zu diesem Artikel

What thermal limit does the 12.8 W/mK pad hit first during continuous load?

The pad transfers heat at 12.8 W/mK, so the bottleneck becomes the heatsink or cooler capacity rather than the pad itself.

Does the silicone pad dry out, harden or change noise levels when run all day?

The material is non-curing and non-corrosive, so it stays flexible and silent with no pump-out or hardening over time.

Which components must already be in place for the 85 x 45 mm pad to work?

A clean mating surface on the CPU, GPU, laptop heatsink or LED cooler that matches the 85 x 45 mm footprint and 0.5 mm gap.

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