Thermalright MC-2 ARGB Memory Cooler White 3200 RPM
- Fan & Heatsinks
- DDR/DDR2/DDR3/DDR4/…
Me võtame vastu krüptoraha — nii saab teie hoitav krüptoraha osta päris riistvara.Makske krüptorahaga, kulutage seda päris riistvarale. Tasuta kindlustatud tarne kogu maailmas, üle 399 $. Lihtsad, kaubamärgita väliskarbid, saadetud Saksamaalt.Tasuta kindlustatud tarne üle 399 $. Teie kurss lukustatakse 30 minutiks kohe, kui kassa avaneb.Kurss lukustatud 30 minutiks. Iga toode on pitseeritud, selle seerianumber on kontrollitud ja sellel kehtib 24-kuuline garantii.Pitseeritud, 24-kuulise garantiiga.
HPE
Cools a processor in HPE servers using a 7 lb passive heatsink assembly
This HPE 508996-001 heatsink assembly is engineered for processor cooling in Hewlett Packard Enterprise systems. It serves technicians and IT departments maintaining or repairing compatible server or workstation hardware. The unit provides the necessary thermal interface for the designated processor socket.
The assembly operates without an integrated fan, relying on system airflow directed across its fins to dissipate heat. This design eliminates fan noise and reduces moving-part failure points within the chassis. Power draw is effectively zero as the unit contains no electrical components.
The package contains the heatsink assembly itself without mounting brackets, thermal compound, or retention hardware. Installers must source compatible retention mechanisms and thermal interface material separately for their specific platform. This suits environments where spare mounting kits are already stocked.
| Brand | HP |
|---|---|
| Color | Multi-color |
| Type | Heatsinks only |
| Fan Size | n/a |
| Weight | 7LBS |
Mount the assembly onto the processor socket using the designated retention mechanism, then secure it firmly; the step often missed is verifying full contact between the heatsink base and the processor heat spreader before locking it down.
Periodically clean dust from the fin stack to maintain airflow, and replace the thermal interface material between the heatsink and processor whenever the assembly is removed or reseated.
The heatsink's ability to dissipate heat without active airflow becomes the limiting factor; if case airflow is insufficient, processor temperatures will rise until thermal throttling engages.
Veel samast osakonnast
Sama osakond, sama kassa — kaheksa krüptovaluutat ja 30-minutiline kursilukk.
See, millega maksate, ja see, milles vaatate hindu.
Saadetud teie rahakotist kassas
Ainult kuvamiseks — kataloogi hinnad on dollarites
Ükski vääring ei vasta sellele.
Valige keel, milles sait teiega räägib.
Esimest korda siin?
Teil on juba konto?
Automaatset lähtestamist ei ole: see pood ei saada ühtegi e-kirja, seega pole ka ühekordset linki, mida küsida. Jätke aadress kontole alles, seda käsitletakse käsitsi.
Päring registreeritud
Teie postkasti ei jõua midagi — see pood ei saada e-kirju üldse. Keegi tegeleb sellega käsitsi.
Tuli meelde?