Kingston Technology Corp. KSM32RD4/32MRR 32GB DDR4 3200 CL22 ECC Registered Server RAM
- 32GB
- 288-Pin DDR4 SDRAM
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AMD
A 32-core server processor with 64 threads, 2.9 GHz base frequency, 3.4 GHz max turbo, 128 MB L3 cache, eight-channel DDR4-3200 memory support and 128 lanes of PCIe 4.0 in a 225 W SP3 package
The AMD EPYC 7542 is a 32-core, 64-thread server processor built on 7 nm technology for the Socket SP3 platform. It runs at a base frequency of 2.9 GHz with a maximum turbo frequency of 3.4 GHz. The chip includes 128 MB of L3 cache and 16 MB of L2 cache, delivering high throughput for multi-threaded data centre workloads with a 225 W thermal design power.
This processor fits environments that need high core density and eight channels of DDR4-3200 memory bandwidth within a dual-socket SP3 design. It provides 128 lanes of PCIe 4.0 connectivity for fast storage and networking. Buyers who require integrated graphics, a desktop socket, or lower power envelopes should evaluate alternative product lines.
The 225 W thermal design power is the key specification that determines whether this part fits your infrastructure. It requires server-grade cooling solutions and a chassis with adequate airflow; no cooler is included in the OEM package. Verify that your platform supports this power envelope before purchase.
| Brand | AMD |
|---|---|
| Series | AMD EPYC 7002 |
| Name | EPYC 7542 |
| Model | 100-000000075 |
| CPU Socket Type | Socket SP3 |
| # of Cores | 32-Core |
| # of Threads | 64 |
| Operating Frequency | 2.9 GHz |
| Max Turbo Frequency | 3.4 GHz |
| L3 Cache | 128MB |
| 64-Bit Support | Yes |
| Integrated Memory Controller Speed | DDR4 3200 |
| Memory Channel | 8 Channel |
| PCI Express Revision | 4.0 |
| Max # of PCI Express Lanes | 128 |
| Thermal Design Power | 225W |
| Cooling Device | Cooling device not included - Processor Only |
| Shipping weight | 1.97 kg |
| Package size | 203 × 127 × 76 mm |
The integrated memory controller runs DDR4 at 3200 MT/s across eight channels.
It fits Socket SP3 and has a 225 W TDP; no cooler is included.
The SP3 package drops into the LGA socket without soldering; installers often forget to torque the retention mechanism in the prescribed sequence.
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