DELL Latitude 12 Rugged 7202 Motherboard Core M-5Y71 1.2GHz V11DG
- 8GB
- Laptop motherboard…
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AMD
64-core server processor with 2.0 GHz base clock, 3.3 GHz max turbo, 256 MB L3 cache and 128 PCIe 4.0 lanes for high-throughput workloads
The AMD EPYC 7662 fits the SP3 socket and delivers 64 cores with 128 threads at a 2.0 GHz base clock. It targets data-centre workloads that need high core counts and large memory bandwidth. Buyers who require fewer cores or a different socket should look elsewhere.
The processor carries a 225 W thermal design power and ships without a cooling device, so a compatible SP3 heatsink or liquid block must be sourced separately. Eight DDR4-3200 memory channels and 128 PCIe 4.0 lanes provide extensive I/O for multi-GPU or storage arrays. Systems with limited power delivery or restricted airflow may not sustain full performance.
The tray unit arrives without a retail box, fan or documentation beyond the standard AMD warranty leaflet. No bundled software or management utilities are supplied, so administrators rely on existing infrastructure tools. Organisations needing a boxed cooler or pre-validated firmware images will need a different SKU.
| Brand | AMD |
|---|---|
| Series | AMD EPYC 7002 |
| Name | EPYC 7662 |
| Model | 100-000000137 |
| CPU Socket Type | Socket SP3 |
| # of Cores | 64-Core |
| # of Threads | 128 |
| Operating Frequency | 2.0 GHz |
| Max Turbo Frequency | 3.3 GHz |
| L3 Cache | 256MB |
| 64-Bit Support | Yes |
| Integrated Memory Controller Speed | DDR4 3200 |
| Memory Channel | 8 Channel |
| PCI Express Revision | 4.0 |
| Max # of PCI Express Lanes | 128 |
| Thermal Design Power | 225W |
| Cooling Device | Cooling device not included - Processor Only |
| Shipping weight | 0.45 kg |
| Package size | 203 × 127 × 76 mm |
The processor provides 128 lanes of PCIe 4.0 connectivity, enabling high-speed I/O for GPUs, storage arrays and networking adapters without bottlenecks.
It fits Socket SP3 and needs a server-grade cooler rated for 225 W TDP; no cooling device is included in the box.
Align the triangle marker on the processor with the socket corner, lower it vertically without force, then secure the retention frame; a common error is skipping the torque sequence when tightening the heatsink screws.
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