DELL Latitude 12 Rugged 7202 Motherboard Core M-5Y71 1.2GHz V11DG
- 8GB
- Laptop motherboard…
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Intel
48-core server CPU with 96 threads, 105 MB L3 cache, DDR5-4800 support up to 4 TB, 80 PCIe 5.0 lanes, 350 W TDP
The Intel Xeon Platinum 8468 is a 48-core server processor built for dual-socket platforms that need high thread density. It addresses virtualisation hosts, large-scale databases and compute clusters where 96 threads and 105 MB of L3 cache reduce scheduling pressure. Buyers needing single-socket density beyond this core count or specialised accelerator integration will not find those capabilities here.
The integrated controller runs DDR5 at up to 4800 MT/s with one DIMM per channel and 4400 MT/s with two, across eight channels for a 4 TB maximum capacity. Eighty PCI Express 5.0 lanes provide connectivity for storage arrays, high-speed networking or GPU attachments without lane-starvation. Systems requiring more than eight memory channels or CXL-attached memory tiers fall outside this design.
A 350 W thermal design power demands robust cooling infrastructure; no cooling device is included. The processor scales to two sockets, offering a practical ceiling for workloads that fit within that envelope. Deployments targeting four-socket scale-up, liquid-cooled overclocking beyond 3.80 GHz max turbo, or lower-power density targets should evaluate alternative SKUs.
| Brand | Intel |
|---|---|
| Series | Intel Xeon Platinum |
| Name | Xeon Platinum 8468 |
| Model | PK8071305072501 |
| CPU Socket Type | LGA 4677 |
| Core Name | Sapphire Rapids |
| # of Cores | 48-Core |
| # of Threads | 96 |
| Operating Frequency | 2.1 GHz |
| Max Turbo Frequency | 3.80 GHz |
| L3 Cache | 105MB |
| 64-Bit Support | Yes |
| Manufacturing Tech | 10 nm |
| Integrated Memory Controller Speed | Up to DDR5 4800 MT/s 1DPC Up to DDR5 4400 MT/s 2DPC |
| Maximum Memory Capacity | 4TB |
| Memory Channel | 8 Channel |
| Virtualization Technology Support | Yes |
| Scalability | 2S |
| PCI Express Revision | 5.0 |
| Max # of PCI Express Lanes | 80 |
| Thermal Design Power | 350W |
| Cooling Device | Cooling device not included - Processor Only |
| Shipping weight | 0.23 kg |
| Package size | 127 × 102 × 25 mm |
The processor is sold without a cooling device; a compatible LGA 4677 heatsink or liquid cooler rated for at least 350 W TDP must be sourced separately.
The 350 W thermal design power is the primary constraint; the CPU will throttle clocks to stay within that envelope before other limits are reached.
Noise and temperature depend entirely on the aftermarket cooler chosen; the 350 W TDP means a high-capacity server heatsink or liquid loop is needed to keep thermals and acoustics acceptable.
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