NEMIX RAM ME21300-328K4 128GB (4x32GB) DDR4 2666 ECC UDIMM memory upgrade
- 128GB (4 x 32GB)
- 288-Pin DDR4 ECC UD…
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NEMIX RAM
128 GB DDR4-2933 ECC UDIMM kit (4 × 32 GB, CL21, 1.2 V, 2Rx8) validated for Supermicro X12SAE and X12SCA-F motherboards
Size 128GB 4X32GB
This 128 GB kit provides four 32 GB DDR4 2933 MHz ECC unbuffered UDIMMs built to the precise rank, voltage and timing the Supermicro X12SAE and X12SCA-F motherboards expect. It is aimed at administrators and workstation builders who need verified, full-capacity operation on those specific platforms without manual tuning.
Each module runs at 1.2 V with no heat spreader, so power draw stays low and thermal output is minimal under normal server or workstation loads. Passive cooling in a chassis with adequate airflow is sufficient; the sticks add no audible noise because they have no moving parts.
The kit uses the 288-pin unbuffered ECC UDIMM layout required by the target Supermicro boards; RDIMM or SODIMM modules will not fit or function. Buyers whose systems demand registered DIMMs or a different pin count should look elsewhere.
| Brand | NEMIX RAM |
|---|---|
| Series | NEMIX RAM Original Series Memory |
| Model | DDR4 ECC Unbuffered UDIMM Memory |
| Part Number | ME23400-328K4 |
| Capacity | 128GB (4 x 32GB) |
| Type | 288-Pin DDR4 ECC UDIMM |
| Speed | DDR4 2933 (PC4 23400) |
| CAS Latency | CL21 |
| Voltage | 1.20V |
| ECC | Yes |
| Buffered/Registered | Unbuffered |
| Rank | 2Rx8 |
| Chipset | Major OEM Samsung, Micron, Hynix |
| Heat Spreader | No |
| Compatible System | Supermicro |
| Features | DDR4 ECC Unbuffered UDIMM Motherboard Compatible |
| Package Content | 128GB 4X32GB DDR4 2933MHz PC4-23400 2Rx8 1.2V 288-PIN ECC UDIMM KIT |
Other versions of this model
Same family, different memory, cooler or clock — compare before you commit.
Power down, open the chassis, consult the motherboard manual for the approved DIMM sequence, then press each 288-pin UDIMM firmly into its slot until the retention clips click — skipping the manual's population order is the step most often missed and can prevent full 128GB recognition.
No routine maintenance is required for the DRAM chips; if a module fails it is replaced as a unit under the lifetime replacement warranty.
CL21 sets the minimum row-access delay, so under continuous heavy workloads the CAS latency becomes the first timing bottleneck before bandwidth or voltage limits are reached.
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