SK hynix HMA42GR7AFR4N-TF 16GB DDR4 2133MHz CL15 ECC Registered Dual Rank 1.2V 288-Pin Server RAM
- 16GB
- 288-Pin DDR4 SDRAM
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NEMIX RAM
16 GB DDR3 1333 SODIMM kit (2 × 8 GB) for POSIFLEX XT-5517 JIVA 17" terminal
This 16 GB DDR3 SODIMM kit is built for the POSIFLEX XT-5517 JIVA foldable 17-inch terminal. It contains two matched 8 GB modules that install directly into the system's 204-pin slots without configuration changes.
The modules run at 1.35 V with a standard DDR3 1333 MT/s data rate and CL9 latency. Unbuffered, non-ECC chips from major OEM suppliers keep power draw modest and thermals predictable inside the compact point-of-sale enclosure.
Each 8 GB stick uses a 2Rx8 layout that the terminal's memory controller expects. A different rank structure or a single 16 GB module would not be recognised, so this exact kit is the only drop-in upgrade path for the target hardware.
| Brand | NEMIX RAM |
|---|---|
| Series | POSIFLEX POS Series Point of Sale Kiosk Memory |
| Model | POSIFLEX POS DDR3 1333MHZ Non-ECC Unbuffered SODIMM |
| Part Number | MS10600-828K2 |
| Capacity | 16GB (2 x 8GB) |
| Speed | DDR3 1333 (PC3 10600) |
| ECC | No |
| Buffered/Registered | Unbuffered |
| Chipset | Major OEM Samsung, Micron, Hynix |
| Voltage | 1.50V |
| Compatible System | POSIFLEX POS |
| CAS Latency | CL9 |
| Heat Spreader | No |
| Type | 204-Pin DDR3 SODIMM |
| Rank | 2Rx8 |
| Features | DDR3 Non-ECC Unbuffered SODIMM Motherboard Compatible |
| Package Content | 16GB (2X8GB) DDR3 1333MHZ PC3-10600 2Rx8 1.35V 204-PIN Non-ECC Unbuffered SODIMM KIT |
Power off the terminal, open the memory compartment, align the notch on each 204-pin module with the slot key, insert at an angle then press down until the side clips click; the step often missed is verifying both clips lock fully on each 8GB stick.
The modules have no heat spreaders and use standard 1.50 V DDR3 chips, so no scheduled maintenance is required; replacement is only needed if a module fails, which is covered by the manufacturer's lifetime replacement warranty.
The DDR3 1333 MT/s speed and CL9 latency set the bandwidth ceiling, so memory throughput becomes the first bottleneck under continuous heavy transaction loads.
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