SK hynix HMA42GR7AFR4N-TF 16GB DDR4 2133MHz CL15 ECC Registered Dual Rank 1.2V 288-Pin Server RAM
- 16GB
- 288-Pin DDR4 SDRAM
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NEMIX RAM
16 GB DDR4-3200 ECC unbuffered UDIMM with CL22 latency and 1.2 V operation for ASRock server boards
This 16GB DDR4 3200 ECC unbuffered UDIMM operates at 1.2V with CL22 latency and a 2Rx8 rank configuration. It uses a 288-pin form factor and is validated for ASRock Rack motherboards including the E3C252D4U, E3C252D4U-2T and E3C252D4ID-2T. Modules are built with major OEM chips from Samsung, Micron or Hynix and ship without a heat spreader.
This module suits administrators upgrading ASRock Rack platforms that require ECC unbuffered memory for data integrity. It is not for systems that only accept registered or load-reduced DIMMs. It is also not for desktop boards lacking ECC support in the BIOS or chipset. Buyers needing capacities beyond a single 16GB stick should look at larger kits or higher-density modules.
The CAS latency of CL22 at 3200 MT/s determines the module's timing profile and must match the motherboard's supported memory timings for stable operation. Verify that the target ASRock Rack board lists CL22 3200 ECC UDIMM compatibility before purchase. Mismatched timings can prevent boot or cause instability even if the physical pin count and voltage align.
| Brand | NEMIX RAM |
|---|---|
| Series | ASRock Server Motherboard Compatible Series Memory |
| Model | ASRock DDR4 3200MHZ ECC Unbuffered UDIMM |
| Part Number | ME25600-628K1 |
| Capacity | 16GB |
| Speed | DDR4 3200 (PC4 25600) |
| ECC | Yes |
| Buffered/Registered | Unbuffered |
| Chipset | Major OEM Samsung, Micron, Hynix |
| Voltage | 1.20V |
| Compatible System | ASRock |
| CAS Latency | CL22 |
| Heat Spreader | No |
| Type | 288-Pin DDR4 ECC UDIMM |
| Rank | 2Rx8 |
| Features | DDR4 ECC Unbuffered UDIMM Motherboard Compatible |
| Package Content | 16GB (1X16GB) DDR4 3200MHZ PC4-25600 2Rx8 1.2V CL22 288-PIN ECC Unbuffered UDIMM |
The module has no heat spreader and no user-serviceable parts, so no firmware updates or component swaps are required after installation.
The 1.2 V operating voltage and CL22 latency set the power envelope; sustained loads will hit the JEDEC thermal limit before any electrical ceiling.
With no heat spreader or moving parts the stick is silent, and at 1.2 V its heat output stays within standard DDR4 UDIMM thermal limits.
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