SK hynix HMA42GR7AFR4N-TF 16GB DDR4 2133MHz CL15 ECC Registered Dual Rank 1.2V 288-Pin Server RAM
- 16GB
- 288-Pin DDR4 SDRAM
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NEMIX RAM
Adds 32 GB of DDR4-2133 ECC load-reduced memory to compatible Lenovo servers at 1.2 V CL15
This 32 GB DDR4 2133 module is built for Lenovo servers and workstations that require load-reduced ECC memory. It targets IT teams maintaining qualified platforms where registered DIMMs are mandatory and capacity per slot must stay high.
Operating at 1.20 V, the module draws minimal power and produces no audible noise because it has no heat spreader or moving parts. Thermal output scales with the number of populated slots, so dense configurations benefit from the lower voltage.
The 288-pin LRDIMM form factor with 4Rx4 organisation and CL15 latency only works in motherboards qualified for load-reduced DDR4 2133; systems expecting standard RDIMM or UDIMM will not post with this module installed.
| Brand | NEMIX RAM |
|---|---|
| Series | Lenovo Server/Workstation Compatible Series Memory |
| Model | Lenovo DDR4 2133MHZ ECC LRDIMM Load Reduced Server Memory |
| Part Number | ML17000-344K1 |
| Capacity | 32GB |
| Speed | DDR4 2133 (PC4 17000) |
| ECC | Yes |
| Buffered/Registered | Load Reduced |
| Chipset | Major OEM Samsung, Micron, Hynix |
| Voltage | 1.20V |
| Compatible System | Lenovo |
| CAS Latency | CL15 |
| Heat Spreader | No |
| Type | 204-Pin DDR3 SODIMM |
| Rank | 4Rx4 |
| Features | DDR4 ECC LRDIMM Load Reduced Server Motherboard Compatible |
| Package Content | 32GB (1X32GB) DDR4 2133MHZ PC4-17000 4Rx4 1.2V CL15 288-PIN ECC LRDIMM Load Reduced Server Memory |
Align the notch on the module with the slot key, press down firmly until both side clips lock automatically, then verify in BIOS that the 32GB capacity and 2133 speed are recognised.
The module has no moving parts or heat spreader, so no routine maintenance is required; replacement is only necessary if a memory test reports uncorrectable ECC errors.
The CAS latency of CL15 at 2133 MT/s sets the throughput ceiling before voltage or thermal constraints become factors.
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