NEMIX RAM DDR4 32GB 3200MHz CL22 2Rx8 1.2V 288-Pin UDIMM memory upgrade
- 32GB
- 288-Pin DDR4 UDIMM
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NEMIX RAM
A 32GB DDR4 UDIMM running at 3200MHz with CL22 latency and 1.2V, matched to the ASUS Pro Q670M-CE D4-CSM motherboard
Size 32GB
This 32GB DDR4 3200MHz PC4-25600 UDIMM module is built to the exact rank, voltage and timing the ASUS Pro Q670M-CE D4-CSM memory controller expects. It installs as a single 288-pin Non-ECC Unbuffered DIMM so the board recognises the full capacity at its rated speed. Desktop users adding memory to this specific motherboard get a direct fit without configuration guesswork.
The module uses Samsung, Micron or Hynix ICs validated for stability at CL22 latency and 1.20V operating voltage. No heat spreader is included, keeping the profile low for tight CPU cooler clearances. The 2Rx8 organisation matches the population rules of the target board so the upgrade posts at full frequency without manual BIOS adjustment.
Before ordering, consult your system or motherboard documentation for the maximum supported capacity per slot and the approved DIMM population sequence. Builders needing ECC, registered modules or SODIMM form factors cannot use this kit. Verify the board revision matches the Q670M-CE D4-CSM designation to avoid fitment issues.
| Brand | NEMIX RAM |
|---|---|
| Series | NEMIX RAM Original Series Memory |
| Model | DDR4 Non-ECC Unbuffered UDIMM Memory |
| Part Number | MD25600-328K1 |
| Capacity | 32GB |
| Type | 288-Pin DDR4 UDIMM |
| Speed | DDR4 3200 (PC4 25600) |
| CAS Latency | CL22 |
| Voltage | 1.20V |
| ECC | No |
| Buffered/Registered | Unbuffered |
| Rank | 2Rx8 |
| Chipset | Major OEM Samsung, Micron, Hynix |
| Heat Spreader | No |
| Compatible System | ASUS |
| Features | DDR4 Non-ECC Unbuffered UDIMM Motherboard Compatible |
| Package Content | 32GB DDR4 3200MHz PC4-25600 2Rx8 1.2V 288-PIN Non-ECC UDIMM KIT |
Other versions of this model
Same family, different memory, cooler or clock — compare before you commit.
The module uses a fixed 2Rx8 organization with major OEM chips from Samsung, Micron or Hynix and has no heat spreader; it is designed to run at its rated CL22 timing without further changes.
The CL22 latency at 1.20 V is the primary constraint; the memory controller on the ASUS Pro Q670M-CE D4-CSM will operate at this timing as the sustained ceiling.
At 1.20 V the module draws standard DDR4 power for its density and, lacking a heat spreader, relies on case airflow to stay within normal operating temperatures.
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