SK hynix HMA42GR7AFR4N-TF 16GB DDR4 2133MHz CL15 ECC Registered Dual Rank 1.2V 288-Pin Server RAM
- 16GB
- 288-Pin DDR4 SDRAM
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NEMIX RAM
A 4 GB DDR3 SODIMM running at 1600 MHz with 1.35 V low voltage for Samsung laptop upgrades
This NEMIX RAM module delivers 4 GB of DDR3 1600 memory in a 204-pin SODIMM form factor. It is built for Samsung laptops and all-in-one PCs that accept PC3-12800 unbuffered non-ECC memory. The 1.35 V operation matches low-voltage requirements in compatible systems.
Verify that your Samsung device supports 1.35 V DDR3 SODIMMs and has a free 204-pin slot before ordering. Confirm the maximum memory per slot and total system capacity in the owner's manual. This module is non-ECC and unbuffered, so it will not work in platforms that require registered or error-correcting memory.
The package contains one 4 GB stick, allowing a straightforward upgrade without needing matched pairs. No heat spreader is included, keeping the profile low for tight laptop chassis. The module uses Samsung, Micron or Hynix components and is stress tested for stability in compatible systems.
| Brand | NEMIX RAM |
|---|---|
| Series | Samsung Laptop, AIO All-in-One PC Compatible Series Memory |
| Model | Samsung DDR3 1600MHZ Non-ECC Unbuffered SODIMM |
| Part Number | MS12800-428K1 |
| Capacity | 4GB |
| Speed | DDR3 1600 (PC3 12800) |
| ECC | No |
| Buffered/Registered | Unbuffered |
| Chipset | Major OEM Samsung, Micron, Hynix |
| Voltage | 1.35V |
| Compatible System | Samsung |
| CAS Latency | CL11 |
| Heat Spreader | No |
| Type | 204-Pin DDR3 SODIMM |
| Rank | 2Rx8 |
| Features | DDR3 Non-ECC Unbuffered SODIMM Motherboard Compatible |
| Package Content | 4GB (1X4GB) DDR3 1600MHZ PC3-12800 2Rx8 1.35V 204-PIN Non-ECC Unbuffered SODIMM |
The package contains one 4 GB 1.35 V DDR3 1600 SODIMM module and nothing else.
This module is built as 2Rx8 with CL11 latency to match the Samsung M471B5273CH0-CK0 specification.
Yes, the module is rated DDR3 1600 (PC3-12800) and will operate at that speed when the platform supports it.
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