SK hynix HMA42GR7AFR4N-TF 16GB DDR4 2133MHz CL15 ECC Registered Dual Rank 1.2V 288-Pin Server RAM
- 16GB
- 288-Pin DDR4 SDRAM
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NEMIX RAM
A 64 GB kit of four 16 GB DDR5 4800 CL40 UDIMM modules at 1.1 V for the HP Z2 G9 Tower Workstation
This 64GB kit contains four 16GB DDR5 4800 UDIMM modules built for the HP Z2 G9 Tower Workstation. It targets IT professionals and workstation owners who need a validated memory upgrade for that specific platform.
The modules run at 1.10V without a heat spreader, relying on the workstation's internal airflow for cooling. Unbuffered non-ECC DDR5 at CL40 keeps power draw low and acoustic impact negligible in normal workloads.
Every module is stress tested under load before shipping and covered by a lifetime replacement warranty. US-based IT support staff are available to assist with installation or compatibility questions.
| Brand | NEMIX RAM |
|---|---|
| Series | HPE Server/Workstation Compatible Series Memory |
| Model | HPE DDR5 4800MHZ Non-ECC Unbuffered UDIMM |
| Part Number | MD38400-618K4 |
| Capacity | 64GB (4 x 16GB) |
| Speed | DDR5 4800 (PC5 38400) |
| ECC | No |
| Buffered/Registered | Unbuffered |
| Chipset | Major OEM Samsung, Micron, Hynix |
| Voltage | 1.10V |
| Compatible System | HPE |
| CAS Latency | CL40 |
| Heat Spreader | No |
| Type | 288-Pin DDR5 UDIMM |
| Rank | 1Rx8 |
| Features | DDR5 Non-ECC Unbuffered UDIMM Motherboard Compatible |
| Package Content | 64GB (4X16GB) DDR5 4800MHZ PC5-38400 1Rx8 1.1V CL40 288-PIN Non-ECC Unbuffered UDIMM KIT |
Power off and unplug the workstation, open the chassis, align each module's notch with the slot key, press down firmly until the retention clips click on both sides, then verify all four 16 GB sticks are fully seated before closing the case.
No scheduled maintenance is required; the modules have no heat spreader and run at 1.1 V, so only replace a stick if diagnostics report a memory error, which is covered by the lifetime replacement warranty.
The CAS latency of 40 cycles at 4800 MT/s sets the baseline response time; under continuous load the memory controller's thermal throttle point will be reached before the modules themselves become a bottleneck.
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