Micron Technology, Inc. MT4JTF12864AZ-1G4D1 1GB DDR3 1333 Desktop RAM
- 1GB
- DDR3 1333 (PC3 1060…
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NEMIX RAM
8GB DDR4 2666 CL19 desktop module runs at 1.2V with 288-pin unbuffered design
This NEMIX RAM stick delivers 8 GB of DDR4 memory at 2666 MT/s with a CL19 latency. It uses the standard 288-pin UDIMM form factor and runs at 1.2 V. The module is unbuffered and non-ECC, making it suitable for typical consumer desktop boards.
Operating at 1.20 V means the module draws little power and generates minimal heat during normal workloads. With no heat spreader or onboard LEDs, the bare PCB relies on case airflow, which is usually sufficient for JEDEC-speed memory. There are no moving parts, so the module adds no audible noise to the system.
The 1Rx8 organisation fits into any standard DDR4 DIMM socket without requiring special chipset features. Because it occupies only one slot, remaining sockets stay open for future capacity increases. Compatibility notes reference Dell part numbers SNP5H5PWC/8G and A9845650 as examples of supported platforms.
| Brand | NEMIX RAM |
|---|---|
| Series | NEMIX RAM DDR4 Orignial Desktop PC 288-Pin Non-ECC Unbuffered UDIMM Memory |
| Model | Original Series DDR4 Desktop PC Memory Solutions |
| Part Number | MD21300-818K1 |
| Capacity | 8GB |
| Type | 288-Pin DDR4 UDIMM |
| Speed | DDR4 2666 (PC4 21300) |
| CAS Latency | CL19 |
| Voltage | 1.20V |
| ECC | No |
| Buffered/Registered | Unbuffered |
| Chipset | Major OEM Samsung, Micron, Hynix |
| Heat Spreader | No |
| Features | DDR4 Non-ECC Unbuffered UDIMM Motherboard Compatible |
| LED Color | None |
Align the notch on the module with the key in the 288-pin slot, press down firmly until both side clips click shut, then verify in BIOS that the memory runs at DDR4 2666 CL19.
No routine maintenance is required; keep the gold contacts clean and ensure the motherboard supplies a steady 1.20 V. Replace only if memory errors appear or capacity becomes insufficient.
The CL19 latency at DDR4 2666 sets the throughput ceiling; without a heat spreader the chips rely on case airflow, so thermal throttling can occur before voltage or capacity limits are reached.
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